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MC33886 Datasheet

  • MC33886

  • 5.0 A H-Bridge

  • Motorola   Motorola

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Freescale Semiconductor, Inc.
PACKAGE INFORMATION
The 33886 is designed for enhanced thermal performance.
The significant feature of this device is the exposed copper pad
on which the power die is soldered. This pad is soldered on a
PCB to provide heat flow to ambient and also to provide thermal
capacitance. The more copper area on the PCB, the better the
power dissipation and transient behavior will be.
Example
Characterization on a double-sided PCB: bottom
side area of copper is 7.8 cm
2
; top surface is 2.7 cm
2
(see
Figure 19);
grid array of 24 vias 0.3 mm in diameter.
Figure 20
shows the thermal response with the device
soldered on to the test PCB described in
Figure 19.
100
10
Rth (擄C/W)
1
Freescale Semiconductor, Inc...
0,1
0,001
0,01
0,1
1
10
t, Time (s)
100
1000
10000
Figure 20. 33886 Thermal Response
Top Side
Bottom Side
Figure 19. PCB Test Layout
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
For More Information On This Product,
Go to: www.freescale.com
33886
17

MC33886 PDF文件相關(guān)型號(hào)

PC33886

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