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High temperature soldering 260 潞C 10 sec
2.0
Year code
Type No. Closs
4.2
Standard soldering pad
MECHANICAL DATA
Terminals: Solder plated, solderable per IEC 68-2-20.
Standard Packaging: 4 mm. tape (EIA-RS-481).
Weight: 0.064 g.
Maximum Ratings and Electrical Characteristics at 25 潞C
P
tot
P
tot
T
j
T
stg
V
F
R
th j-c
R
th j-a
PCB epoxy-glass path 1.5 mm
PCB epoxy-glass path 5 x 10 mm
Ceramic Plate (Al
2
O
3
) path 5 x 10 mm
Other voltages upon request
Power dissipation at Tamb = 25 潞C
R
th j-a
= 100 潞C/W
Power dissipation at Tamb = 25 潞C
R
th j-a
= 25 潞C/W
Operating temperature range
Storage temperature range
Max. forward voltage drop at I
F
= 0.5 A
1.3 W
3.25 W
- 65 to + 175 潞C
- 65 to + 175 潞C
1.0 V
25 潞C/W
150 潞C/W
125 潞C/W
100 潞C/W
Jan - 04