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XCV1000E-6BG560C Datasheet

  • XCV1000E-6BG560C

  • Virtex-E 1.8 V Field Programmable Gate Arrays

  • 5頁

  • XILINX   XILINX

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Virtex鈩?E 1.8 V
Field Programmable Gate Arrays
0
0
DS022-1 (v2.2) November 9, 2001
Preliminary Product Specification
Features
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Fast, High-Density 1.8 V FPGA Family
- Densities from 58 k to 4 M system gates
- 130 MHz internal performance (four LUT levels)
- Designed for low-power operation
- PCI compliant 3.3 V, 32/64-bit, 33/ 66-MHz
Highly Flexible SelectI/O+鈩?Technology
- Supports 20 high-performance interface standards
- Up to 804 singled-ended I/Os or 344 differential I/O
pairs for an aggregate bandwidth of > 100 Gb/s
Differential Signalling Support
- LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL
- Differential I/O signals can be input, output, or I/O
- Compatible with standard differential devices
- LVPECL and LVDS clock inputs for 300+ MHz
clocks
Proprietary High-Performance SelectLink鈩?/div>
Technology
- Double Data Rate (DDR) to Virtex-E link
- Web-based HDL generation methodology
Sophisticated SelectRAM+鈩?Memory Hierarchy
- 1 Mb of internal configurable distributed RAM
- Up to 832 Kb of synchronous internal block RAM
- True Dual-Port鈩?BlockRAM capability
- Memory bandwidth up to 1.66 Tb/s (equivalent
bandwidth of over 100 RAMBUS channels)
- Designed for high-performance Interfaces to
External Memories
- 200 MHz ZBT* SRAMs
- 200 Mb/s DDR SDRAMs
- Supported by free Synthesizable reference design
* ZBT is a trademark of Integrated Device Technology, Inc.
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
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High-Performance Built-In Clock Management Circuitry
- Eight fully digital Delay-Locked Loops (DLLs)
- Digitally-Synthesized 50% duty cycle for Double
Data Rate (DDR) Applications
- Clock Multiply and Divide
- Zero-delay conversion of high-speed LVPECL/LVDS
clocks to any I/O standard
Flexible Architecture Balances Speed and Density
- Dedicated carry logic for high-speed arithmetic
- Dedicated multiplier support
- Cascade chain for wide-input function
- Abundant registers/latches with clock enable, and
dual synchronous/asynchronous set and reset
- Internal 3-state bussing
- IEEE 1149.1 boundary-scan logic
- Die-temperature sensor diode
Supported by Xilinx Foundation鈩?and Alliance Series鈩?/div>
Development Systems
- Further compile time reduction of 50%
- Internet Team Design (ITD) tool ideal for
million-plus gate density designs
- Wide selection of PC and workstation platforms
SRAM-Based In-System Configuration
- Unlimited re-programmability
Advanced Packaging Options
- 0.8 mm Chip-scale
- 1.0 mm BGA
- 1.27 mm BGA
- HQ/PQ
0.18
m
m 6-Layer Metal Process
100% Factory Tested
漏 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at
http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS022-1 (v2.2) November 9, 2001
Preliminary Product Specification
www.xilinx.com
1-800-255-7778
Module 1 of 4
1

XCV1000E-6BG560C 產(chǎn)品屬性

  • 1

  • 集成電路 (IC)

  • 嵌入式 - FPGA（現(xiàn)場可編程門陣列）

  • Virtex®-E

  • 6144

  • 27648

  • 393216

  • 404

  • 1569178

  • 1.71 V ~ 1.89 V

  • 表面貼裝

  • 0°C ~ 85°C

  • 560-LBGA，金屬

  • 560-MBGA（42.5x42.5）

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