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WED3C750A8M-200BI Datasheet

  • WED3C750A8M-200BI

  • Microprocessor

  • 10頁

  • ETC

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White Electronic Designs
RISC Microprocessor Module
OVERVIEW
The WEDC 750/SSRAM module is targeted for high
performance, space sensitive, low power systems and
supports the following power management features:
doze, nap, sleep and dynamic power management.
The WED3C750A8M-200BX multi-chip package con-
sists of:
聲 750 RISC processor
聲 Dedicated 1MB SSRAM L2 cache, configured as
128Kx72
聲 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
聲 Maximum Core frequency = 200MHz
WED3C750A8M-200BX
聲 Maximum L2 Cache frequency = 100MHz
聲 Maximum 60x Bus frequency = 66MHz
The WED3C750A8M-200BX is offered in industrial (-
40擄C to +85擄C) and military (-55擄C to +125擄C) tem-
perature ranges and is well suited for embedded ap-
plications such as missiles, aerospace, flight comput-
ers, fire control systems and rugged critical systems.
* This data sheet describes a product that is not recommended for
new designs.
FIG. 1
MULTI-CHIP PACKAGE DIAGRAM
NO
TR
EC
OM
ME
ND
ED
October 2002 Rev. 9
1
White Electronic Designs Corporation 聲 (602) 437-1520 聲 www.whiteedc.com
FO
R
NE
W
DE
SI
GN
S*

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