WE128K32-XXX
HI-RELIABILITY PRODUCT
128Kx32 EEPROM MODULE, SMD 5962-94585
FEATURES
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Access Times of 120*, 140, 150, 200, 250, 300ns
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Packaging:
鈥?66-pin, PGA Type, 27.3mm (1.075") square, Hermetic
Ceramic HIP (Package 400)
鈥?68 lead, 40mm CQFP (G4), (Package 501)
鈥?68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180") high,
(Package 509)
鈥?68 lead, 22.4mm sq. Low Profile CQFP (G1U), 3.57mm
(0.140") high, (Package 519)
Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8
Write Endurance 10,000 Cycles
Data Retention Ten Years Minimum (at +25擄C)
Commercial, Industrial and Military Temperature Ranges
Low Power CMOS
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Automatic Page Write Operation
Page Write Cycle Time: 10ms Max
Data Polling for End of Write Detection
Hardware and Software Data Protection
TTL Compatible Inputs and Outputs
5 Volt Power Supply
Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
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Weight
WE128K32-XG2TX - 8 grams typical
WE128K32-XG1UX - 5 grams typical
WE128K32-XH1X - 13 grams typical
WE128K32-XG4X - 20 grams typical
* 120ns not available for SMD product
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FIG. 1
PIN CONFIGURATION FOR WE128K32N-XH1X
TOP VIEW
PIN DESCRIPTION
34
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
33
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
56
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
11
12
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
22
23
I/O
0-31
Data Inputs/Outputs
A
0-16
WE
1-4
CS
1-4
OE
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
I/O
28
A
0
A
1
A
2
I/O
23
OE
WE
1
CS
1
A
0-16
128K x 8
V
CC
GND
NC
BLOCK DIAGRAM
WE
2
CS
2
WE
3
CS
3
WE
4
CS
4
I/O
22
I/O
21
I/O
20
128K x 8
128K x 8
128K x 8
8
8
8
8
66
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
July 2001 Rev. 5
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White Electronic Designs Corporation 鈥?(602) 437-1520 鈥?www.whiteedc.com