鈥?/div>
Non Inductive: < 0.08碌H
鈥?Terminal Finishes Available:
Lead (Pb)-free (Sn 99.3% Cu 0.7%)
Tin/Lead Alloy (Sn 62% Pb 36% Ag 2%)
Product may not
be to scale
The VSM0805 represents the latest addition and smallest size
to the Precision Bulk Metal
廬
Foil (BMF) technology surface
mount chip resistor series. The VSM0805 has a conventional
full wrap around termination.
The BMF technology offers designers the lowest and most
predictable absolute Temperature Coefficient Resistance
available. The TCR is a process capability not a selection
process and for the most part is independent of ohmic value
and lot related variations.
The availability of tight absolute tolerance provides a good cost
solution for the variability of other components when compiling
the total error budget. BMF offers the best stability available;
and is an order of magnitude better than thin film technology.
The noise generated by the resistor is non measurable and its
design and construction make it well suited for high frequency
applications. The BMF is the ultimate resistor component for
analog applications.
TABLE 1 - TOLERANCE VERSUS RESISTANCE VALUE
VALUE
(
鈩?/div>
)
250鈩?to 12K
100鈩?to < 250
50鈩?to < 100
25鈩?to < 50
10鈩?to < 25
5.5鈩?to <10
TIGHTEST
TOLERANCE (%)*
鹵
0.01
鹵
0.02
鹵
0.05
鹵
0.1
鹵
0.25
鹵
0.5
FIGURE 1 - NOMINAL TCR CURVE
鈥?5
鈥?0
+500
+400
+300
+200
+100
鈥?5
0
+25
+50
+75
+100
+125
*Tighter tolerances are available. Please contact Application
Engineering. Soldering temperatures used during installation may
cause resistance to shift up to 0.05%.
-5
+5
pp
m
pp
m
Nominal Resistance/
Temperature (RT) Curve
TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS
TEST
MIL-PRF-55342G
CHARACTERISTIC. E
鈭?/div>
R LIMITS
鹵
0.10%
鹵
0.10%
鹵
0.10%
鹵
0.10%
鹵
0.20%
鹵
0.20%
鹵
0.50%
VSM
MAXIMUM
鈭?/div>
R LIMITS*
鹵
0.02%
鹵
0.02%
鹵
0.02%
鹵
0.05%
鹵
0.05%
鹵
0.10%
鹵
0.025%
鈭哛
R
(ppm)
0
鈥?00
鈥?00
鈥?00
鈥?00
鈥?00
Maximum
Spread
鹵2.3
ppm/擄C
+2.2 ppm/擄C
Nominal Chord
Slope (TCR)
鈥?.8 ppm/擄C
Nominal Chord
Slope (TCR)
Standard
Spread
鹵2.0
ppm/擄C
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
鈥?5擄C / +25擄C / +125擄C are the test points
with +25擄C as the reference temperature
The TCR for values < 100鈩?are influenced by the termination
composition and result in a deviation from this curve. Contact our
application engineering department for detailed specification on low
values
Moisture Resistance
Life 2000 hours @ + 70
擄
C
*As shown + 0.01 Ohms to allow for measurement errors at low values.
SALES
鈥?ISRAEL: foilsales.israel@vishay.com
鈥?FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com
鈥?AMERICAS: foilsales.usa@vishay.com
鈥?ASIA/JAPAN: foilsales.asia@vishay.com 鈥?UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com 鈥?GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
www.vishay.com
22
For technical questions in the Americas, contact foilsupport1@vishay.com
Document Number: 63061
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
Revision 17-Aug-04
VISHAY
1
2
