110m鈩?/div>
I
OUT
5A (*)
V
CC
36 V
OUTPUT CURRENT (CONTINUOUS): 5A
s
CMOS COMPATIBLE INPUTS
s
MULTIPLEXED PROPORTIONAL LOAD
CURRENT SENSE
s
UNDERVOLTAGE & OVERVOLTAGE
SHUT- DOWN
s
OVERVOLTAGE CLAMP
s
THERMAL SHUT DOWN
s
CURRENT LIMITATION
s
VERY LOW STAND-BY POWER DISSIPATION
s
PROTECTION AGAINST:
n
LOSS OF GROUND & LOSS OF V
CC
s
REVERSE BATTERY PROTECTION (**)
DESCRIPTION
The VNQ05XSP16 is a monolithic device
designed in STMicroelectronics VIPower M0-3
PowerSO-16
TM
ORDER CODES
PACKAGE
TUBE
T&R
PowerSO-16鈩?VNQ05XSP16 VNQ05XSP1613TR
Technology. It is intended for driving any type of
multiple loads with one side connected to ground.
Active V
CC
pin voltage clamp protects the device
against low energy spikes (see ISO7637 transient
compatibility table). This device has four
independent channels and one multiplexed analog
sense output which deliver a current proportional
to the selected output current. SenseEnable pin
allows to connect any number of VNQ05XSP16 on
the same Current Sense line. Active current
limitation combined with thermal shut-down and
automatic restart protect the device against
overload. Device automatically turns off in case of
ground pin disconnection.
Value
41
-0.3
Internally limited
-5
+/- 10
-3
+15
-200
4000
2000
5000
5000
78
76
Internally limited
- 40 to 150
-55 to 150
Unit
V
V
A
A
mA
V
V
mA
V
V
V
V
W
mJ
擄C
擄C
擄C
ABSOLUTE MAXIMUM RATING
Symbol
V
CC
-V
CC
I
OUT
I
R
I
IN
V
CSENSE
I
GND
Parameter
Supply voltage (continuous)
Reverse supply voltage (continuous)
Output current (continuous), for each channel
Reverse output current (continuous), for each channel
Input current (IN1,IN2,IN3,IN4,SELA,SELB,SENSENABLE)
Current sense maximum voltage
Ground current at T
case
<25擄C (continuous)
Electrostatic Discharge (Human Body Model: R=1.5鈩? C=100pF)
- INPUT
V
ESD
- CURRENT SENSE
- OUTPUT
P
tot
E
MAX
T
j
T
c
T
STG
- V
CC
Power dissipation at T
case
=25擄C
Maximum Switching Energy
(L=1.72mH; R
L
=0鈩? V
bat
=13.5V; T
jstart
=150潞C; I
L
=7.5A)
Junction operating temperature
Case Operating Temperature
Storage temperature
(**) See application schematic at page 9
March 2003
1/17