鈮?/div>
50
ms)
Drain Current
鈭?Continuous
鈭?Pulsed
Total Power Dissipation @ T
A
= 25擄C
Derate above 25擄C
Operating and Storage Temperature Range
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
3
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction鈭抰o鈭扐mbient
Maximum Lead Temperature for
Soldering Purposes, 1/16鈥?from case
for 10 seconds
Symbol
R
qJA
T
L
Max
312.5
300
Unit
擄C/W
擄C
MARKING DIAGRAM
& PIN ASSIGNMENT
VN22
22LL
AYWW
1
Source
3
Drain
2
Gate
A
Y
WW
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Preferred
devices are recommended choices for future use
and best overall value.
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
漏
Semiconductor Components Industries, LLC, 2004
1
September, 2004 鈭?Rev. 3
Publication Order Number:
VN2222LL/D
1
2
3
4
