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Glass passivated chip junction
0.320 (8.13)
0.360 (9.14)
1
K
2
0.575 (14.60)
0.625 (15.88)
SEATING
PLATE
-T-
0.090 (2.29)
0.110 (2.79)
0.018 (0.46)
0.025 (0.64)
0.027 (0.686)
0.037 (0.940)
0.080 (2.03)
0.110 (2.79)
0.095 (2.41)
0.100 (2.54)
MECHANICAL DATA
Case:
JEDEC TO-263AB molded plastic body
Terminals:
Plated leads, solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Mounting Torque:
5 in. - lbs. max.
Weight:
0.08 ounce, 2.24 grams
PIN 1
K - HEATSINK
PIN 2
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS UGB10ACT UGB10BCT UGB10CCT UGB10DCT UNITS
Maximum repetitive peak reverse voltage
Working peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
C
=100擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) per leg
Maximum instantaneous forward voltage per leg at I
F
=10A,
I
F
=5A,
I
F
=5A,
Maximum reverse leakage current per leg
at working peak reverse voltage
Maximum reverse recovery time per leg at
I
F
=1.0A, di/dt=100A/碌s, V
R
=30V, I
rr
=0.1 I
RM
Maximum reverse recovery time per leg at
I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
Maximum reverse recovery current per leg at
I
F
=5A, di/dt=50A/碌s,V
R
=30V
Maximum stored charge per leg
I
F
=2A, di/dt=20A/碌s, V
R
=30V I
rr
=0.1 I
RM
Typical thermal resistance from junction to case per leg
Operating junction and storage temperature range
Maximum
Typical
Maximum
Typical
T
J
=25擄C
T
J
=25擄C
T
J
=150擄C
T
J
=25擄C
T
J
=100擄C
V
RRM
V
RWM
V
RMS
V
DC
I
(AV)
I
FSM
50
50
35
50
100
100
70
100
10
60
1.25
1.10
0.895
10
200
25
25
15
0.7
5.5
4.5
4.5
150
150
105
150
200
200
140
200
Volts
Volts
Volts
Volts
Amps
Amps
V
F
Volts
碌A(chǔ)
ns
ns
Amps
nC
擄C/W
擄C
I
R
t
rr
t
rr
I
RM
Q
rr
R
螛JC
T
J
, T
STG
-40 to +150
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