UDN2993B and UDN2993LB. These dual full-bridge motion control
and sink (lower) drivers in an H-bridge configuration. The single-chip
by discrete component circuitry.
鈮?/div>
+150擄C
Load Supply Voltage, V
BB
....................
30 V
Logic Supply Voltage, V
DD
...................
7.0 V
Logic Input Voltage Range, V
PHASE
or
V
ENABLE
...............
-0.3 V to V
DD
+ 0.3 V
Output Current, I
OUT
.....................
鹵
600 mA
Sink Driver Emitter Voltage,
V
E
..................................................
1.5 V
Package Power Dissipation,
P
D
........................................
See Graph
Operating Temperature Range,
T
A
.................................
-20
擄
C to +85
擄
C
Storage Temperature Range,
T
S
...............................
-55
擄
C to +150
擄
C
IMPORTANT: Load supply voltage must never be
applied without logic supply voltage present.
NOTE: Output current rating may be limited by
chopping frequency, ambient temperature,
airflow, and heat sinking. Under any set of
conditions, do not exceed the specified maximum
current and a junction temperature of +150擄C.
T
C
U Y
D L
O N
R O
P E
D C
E N
U E
N ER
I
T F
N E
O R
C R
S O
I
D F
鈥?/div>
1
2
3
4
5
V
BB
V
DD
16
15
14
13
12
11
LOGIC SUPPLY
ENABLE
B
PHASE
B
PHASE
A
UDN2993B
LOGIC
LOGIC
GROUND
GROUND
GROUND
OUT
1B
OUT
2B
GROUND
OUT
1A
6
OUT
2A
7
V
EA
8
10
9
V
EB
Dwg. No. A-12,455
Excepting the power supply connections, the two H-bridges are
independent. An ENABLE input is provided for each bridge and
permits pulse-width modulation (PWM) through the use of external
circuitry. PWM drive techniques provide the benefits of reduced power
dissipation, improved motor performance (especially torque), and
positively affect system efficiency. Separate PHASE inputs for each
bridge determine the direction of current flow in the load. Additionally,
each pair of (sink) emitters are terminated to package connections.
This allows the use of current-sensing circuitry. Both devices
incorporate an intrinsic 鈥渄ead time鈥?to preclude high crossover
(or cross-conduction) currents during changes in direction (phase).
These devices are packaged in plastic DIPs (suffix B) or surface-
mountable wide-body SOICs (suffix LB) with copper lead frames for
optimum power dissipation without heat sinks. The lead configurations
allow automatic insertion, fit standard IC sockets or printed wiring
board layouts, and enable easy attachment of a heat sink for maximum
power-handling capability. The heat-sink tabs are at ground potential
and require no insulation.
Dual full-bridge drivers with peak current ratings of
鹵3
A are
supplied as the UDN2998W.
FEATURES
s
s
s
s
s
s
s
鹵600
mA Output Current
Output Voltage to 30 V
Crossover Current Protection
TTL/NMOS/CMOS Compatible Inputs
Low Input Current
Internal Clamp Diodes
Automotive Capable
Package
16-Pin DIP
Always order by complete part number:
Part Number
UDN2993B
UDN2993LB
20-Lead Wide-Body SOIC
1
2
3
4
5
6
7
8
