, Vgs @ 2.5V, Ids @ 3.1A = 95m鈩?/div>
Pin assignment:
1. Gate
2. Source
3. Drain
Features
Advanced trench process technology
High density cell design for ultra low on-resistance
Excellent thermal and electrical capabilities
Compact and low profile SOT-23 package
Block Diagram
Ordering Information
Part No.
TSM2302CX
Packing
Tape & Reel
Package
SOT-23
Absolute Maximum Rating
(Ta = 25鈩?/div>
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Maximum Power Dissipation
unless otherwise noted)
Symbol
V
DS
V
GS
I
D
I
DM
Ta = 25
o
C
Ta = 75
o
C
P
D
Limit
20V
鹵8
2.4
10
1.25
0.8
Unit
V
V
A
A
W
Operating Junction Temperature
Operating Junction and Storage Temperature Range
T
J
T
J
, T
STG
+150
- 55 to +150
o
o
C
C
Thermal Performance
Parameter
Lead Temperature (1/8鈥?from case)
Junction to Ambient Thermal Resistance (PCB mounted)
Note: Surface mounted on FR4 board t<=5sec.
Symbol
T
L
R
胃ja
Limit
5
100
Unit
S
o
C/W
TSM2302
1-1
2003/12 rev. C
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