鈮?/div>
H)
Agency Approvals:
Universal Modular Fuse, IEC127-4
UL Recognition, Std. 248-14, File E19180, Guide JDYX2
CSA Certified, C22.2 No. 248.14, File 53787, Class 1422-30
Additional Approvals Pending
General Information:
鈥?Surge resistant time-lag fuse.
鈥?Brazed seals: body to end plates.
鈥?Compatible with wave soldering.
鈥?Excellent environmental integrity.
鈥?Economical overcurrent protection.
Time Current Characteristics:
125% of Rating: carry 1 hour min.
200%: Open within 2 minutes.
1000%: Open within 0.01 to 0.1 seconds.
2.50
鹵
0.15
(0.098
鹵
0.006)
Construction
1
2
3
4
5
1.
2.
3.
4.
5.
Brass end plate (one of two)*.
High temperature brazing alloy preform (one of two).
Silver metallization*.
Ceramic body.
Spiral wound fusible element.
*End terminations plated with Ni and 90/10 Sn/Pb after assembly.
Packaging and Ordering Information:
Tape and Reel:
Standard 12mm tape, in compliance
with EIA-RS481 (equivalent to IEC 286, Part 3).
6125T
Product
Symbol
(See Table)
Rated Current
Package Code
TR
= 1,000 pieces on tape on a 178mm reel.
SP
= 50 pieces on tape in a plastic box.
Contact Bussmann if other package quantities are required.
CE logo denotes compliance with European Union Low Voltage Directive
(50-1000 VAC, 75-1500 VDC). Refer to BIF document #8002 or contact
Bussmann Application Engineering at 314-527-1270 for more information.
Electrical Characteristics
Part Number
(xx=Package Code)
XX/6125T-250mA
XX/6125T-500mA
XX/6125T-1A
XX/6125T-1.5A
XX/6125T-2A
XX/6125T-3A
XX/6125T-4A
Current Rating
(Amperes)
.25
.5
1
1.5
2
3
4
Marking
B.25
B0.5
B1A
B1.5
B2A
B3A
B4A
Typ. Resistance
@
虜
10% Rated
Current (Ohms)
4.5
1.0
0.25
0.10
0.06
0.04
0.03
Max. Power Dissipation
@ 125% of Rated Current
(Milliwatts)
500
500
500
500
500
1000
1200
XX/6125T-5A
5
B5A
0.02
1200
General Notes:
1.
Device designed to carry 125% of rated current for one hour minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated
ambient temperatures.
2.
All measurements made at 23 鹵 3擄C ambient temperature with the device mounted on a suitable circuit board trace.
12-16-98
SB98107 Rev. A
Form No. 6125T
Page 1 of 2
BIF Doc #3007
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2
