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TPA311DGN Datasheet

  • TPA311DGN

  • 350-mW MONO AUDIO POWER AMPLIFIER

  • 32頁

  • TI

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TPA311
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207B 鈥?JANUARY 1998 鈥?REVISED MARCH 2000
D
D
D
Fully Specified for 3.3-V and 5-V Operation
Wide Power Supply Compatibility
2.5 V 鈥?5.5 V
Output Power for R
L
= 8
鈩?/div>
鈥?350 mW at V
DD
= 5 V, BTL
鈥?250 mW at V
DD
= 5 V, SE
鈥?250 mW at V
DD
= 3.3 V, BTL
鈥?75 mW at V
DD
= 3.3 V, SE
D
D
D
D
D
Shutdown Control
鈥?I
DD
= 7
碌A(chǔ)
at 3.3 V
鈥?I
DD
= 60
碌A(chǔ)
at 5 V
BTL to SE Mode Control
Integrated Depop Circuitry
Thermal and Short-Circuit Protection
Surface Mount Packaging
鈥?SOIC
鈥?PowerPAD鈩?MSOP
D OR DGN PACKAGE
(TOP VIEW)
description
The TPA311 is a bridge-tied load (BTL) or
SHUTDOWN
V
O
鈥?/div>
1
8
single-ended (SE) audio power amplifier devel-
BYPASS
GND
2
7
oped especially for low-voltage applications
SE/BTL
V
DD
3
6
where internal speakers and external earphone
4
5
IN
V
O
+
operation are required. Operating with a 3.3-V
supply, the TPA311 can deliver 250-mW of
continuous power into a BTL 8-鈩?load at less than 1% THD+N throughout voice band frequencies. Although
this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as
cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the
output in most applications, which is particularly important for small battery-powered equipment. A unique
feature of the TPA311 is that it allows the amplifier to switch from BTL to SE
on the fly
when an earphone drive
is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load.
This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually
eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an
8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by
50% and height by 40%.
VDD 6
RF
Audio
Input
RI
CI
2
CBF
BYPASS
4
IN
鈥?/div>
+
VDD/2
VO+ 5
CC
CS
From System Control
From HP Jack
1
3
SHUTDOWN
SE/BTL
Bias
Control
鈥?/div>
+
VO鈥?8
7
GND
350 mW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
漏
2000, Texas Instruments Incorporated
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
1

TPA311DGN 產(chǎn)品屬性

  • 80

  • 集成電路 (IC)

  • 線性 - 音頻放大器

  • -

  • AB 類

  • 1-通道（單聲道）

  • 700mW x 1 @ 8 歐姆

  • 2.5 V ~ 5.5 V

  • 消除爆音，短路保護(hù)和熱保護(hù)，關(guān)閉

  • 表面貼裝

  • 8-MSOP-PowerPad

  • 8-TSSOP，8-MSOP（0.118"，3.00mm 寬）裸露焊盤

  • 管件

  • 296-10836-ND - EVAL MOD FOR TPA311

  • 296-1948296-1948-5296-1948-ND

TPA311DGN相關(guān)型號PDF文件下載

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