ROUT鈥?/div>
SE/BTL
PC-BEEP
GND
DESCRIPTION
The TPA0312 is a stereo audio power amplifier in a 24-pin TSSOP thermally enhanced package capable of
delivering 2.6 W of continuous RMS power per channel into 3-鈩?loads. This device minimizes the number of
external components needed, simplifying the design, and freeing up board space for other features. When driving
1 W into 8-鈩?speakers, the TPA0312 has less than 0.65% THD+N across its specified frequency range. Included
within this device is integrated depop circuitry that virtually eliminates transients that cause noise in the speakers.
Amplifier gain is internally configured and controlled by way of two terminals (GAIN0 and GAIN1). BTL gain
settings of 6 dB, 10 dB, 15.6 dB, and 21.6 dB (inverting) are provided, whereas SE gain is always configured as
4.1 dB for headphone drive. An internal input MUX allows two sets of stereo inputs to the amplifier. The HP/LINE
terminal allows the user to select which MUX input is active, regardless of whether the amplifier is in SE or BTL
mode. In notebook applications, where internal speakers are driven as BTL and the line outputs (often
headphone drive) are required to be SE, the TPA0312 automatically switches into SE mode when the SE/BTL
input is activated, and this reduces the gain to 4.1 dB.
The TPA0312 consumes only 6 mA of supply current during normal operation. A miserly shutdown mode
reduces the supply current to 150 碌A(chǔ).
The PowerPAD鈩?package (PWP) delivers a level of thermal performance that was previously achievable only in
TO-220-type packages. Thermal impedances of approximately 35擄C/W are readily realized in multilayer PCB
applications. This allows the TPA0312 to operate at full power into 8-鈩?loads at an ambient temperature of 85擄C.
AVAILABLE OPTIONS
T
A
鈥?0擄C to 85擄C
(1)
PACKAGED DEVICE
TSSOP
(1)
(PWP)
TPA0312PWP
The PWP package is available taped and reeled. To order a taped
and reeled part, add the suffix R to the part number (e.g.,
TPA0312PWPR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright 漏 2000鈥?004, Texas Instruments Incorporated