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SE/BTL
PC-BEEP
GND
description
The TPA0162 is a stereo audio power amplifier in a 24-pin TSSOP thermally enhanced package capable of
delivering 2 W of continuous RMS power per channel into 3-鈩?loads. This device minimizes the number of
external components needed, which simplifies the design and frees up board space for other features. When
driving 1 W into 8-鈩?speakers, the TPA0162 has less than 0.22% THD+N across its specified frequency range.
Included within this device is integrated depop circuitry that virtually eliminates transients that cause noise in
the speakers.
The overall gain of the amplifier is controlled digitally by the UP and DOWN terminals. At power up, the gain
is set at the lowest level, 鈥?5 dB. It can then be adjusted to any of 31 discrete steps by pulling the voltage down
at the desired pin to logic low. The gain is adjusted in the initial stage of the amplifier as opposed to the power
output stage. As a result, the THD changes very little over all volume levels.
An internal input MUX allows two sets of stereo inputs to the amplifier. In notebook applications, where internal
speakers are driven as BTL and the line outputs (often headphone drive) are required to be SE, the TPA0162
automatically switches into SE mode when the SE/BTL input is activated. This effectively reduces the gain by
6 dB.
The TPA0162 consumes only 20 mA of supply current during normal operation. A miserly shutdown mode is
included that reduces the supply current to less than 150
碌A(chǔ).
The PowerPAD package (PWP) delivers a level of thermal performance that was previously achievable only
in TO-220-type packages. Thermal impedances of approximately 35擄C/W are truly realized in multilayer PCB
applications. This allows the TPA0162 to operate at full power into 8-鈩?loads at ambient temperatures of 85擄C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
漏
2000, Texas Instruments Incorporated
POST OFFICE BOX 655303
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DALLAS, TEXAS 75265
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