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TMS320C54V90BGGU Datasheet

  • TMS320C54V90BGGU

  • EMBEDDED V.90 MODEM DSP

  • 87頁

  • TI

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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F
鈭?/div>
JULY 2001
鈭?/div>
REVISED OCTOBER 2003
D
Provides Two-Chip Modem Solution
D
Data Rates from 300 bps to 56 Kbps
D
Data Modulation Standards
D
Applications
鈭?/div>
鈭?/div>
鈭?/div>
鈭?/div>
鈭?/div>
D
V.90, V.34, V.32bis, V.32, V.22bis, V.22, V.23,
V.21 and V.23 Reversible (Minitel), Bell 212,
Bell 103
FAX Capabilities
鈭?/div>
ITU鈭扵 V.17, V.29, V.27ter Modulations
鈭?/div>
TIA/EIA 578 Class 1 Interface
and V.42bis Compression
Caller ID
D
V.42 or MNP Class 3 and 4 Error Control
D
D
Field-Proven Modem Algorithms Give
D
Highest Performance, Reliability, and
Compatibility
Non-Volatile EEPROM Configuration
Storage
Worldwide Telecom Approvals
D
D
D
Parallel Phone Support Including Parallel
D
D
D
D
D
D
D
D
Phone Detection
Parallel Phone Exclusion Relay Control
Protected Against Surge and Overvoltage
on the Telephone Line
Parallel Host Port Interface Supports a
Variety of Industry Standard Busses
Integral Serial Interface (UART)
Autobaud on Serial DTE Interface
State-of-the-Art Integrated Transformerless
Silicon DAA for Phone Line Interconnection
40K x 16-Bit Dual-Access On-Chip RAM
128K x 16-Bit On-Chip ROM
D
D
D
D
Embedded Systems
Set-Top Boxes
Gaming Consoles
Internet Appliances
Portable Devices
(PDAs, Digital Cameras)
鈭?/div>
Remote Data Collection, Point-of-Sale
鈭?/div>
Meter Reading, Utility Monitoring
On-Chip Peripherals
鈭?/div>
Software-Programmable Wait-State
Generator and Programmable Bank
Switching
鈭?/div>
On-Chip Phase-Locked Loop (PLL) Clock
Generator With Internal Oscillator or
External Clock Source
鈭?/div>
Two Multichannel Buffered Serial Ports
(McBSPs)
鈭?/div>
Enhanced 8-Bit Parallel Host-Port
Interface (HPI8)
Power Consumption Control With IDLE1,
IDLE2, and IDLE3 Instructions With
Power-Down Modes
On-Chip Scan-Based Emulation Logic,
IEEE Std 1149.1
鈥?/div>
(JTAG) Boundary Scan
Logic
8.5-ns Single-Cycle Fixed-Point Instruction
Execution Time (117.96 MIPS) or 17-ns
Instruction Execution Time (58.98 MIPS) for
3.3-V Power Supply (1.5-V Core)
Available in a 144-Pin Plastic Low-Profile
Quad Flatpack (LQFP) (PGE Suffix) and a
144-Pin Ball Grid Array (BGA) (GGU Suffix)
description
The TMS320C54V90 is used to implement a full-featured, high-performance modem technology, intended for
use in embedded systems and similar applications. This highly integrated solution implements a complete
modem using only two chips: the TMS320C54V90 DSP with on-chip RAM and ROM, and the Si3016 line-side
DAA.
The modem can connect to a host system serially (RS-232 functionality), or as an 8-bit peripheral to the
processor in a host system. The TMS320C54V90 uses a standard Digital Signal Processor (DSP) and
proprietary firmware to perform all the modem signal processing, the V.42/V.42bis compression, and AT
commands interpretation for modem control functions.
.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Note:
Human Body Model ESD test performance for this product was demonstrated to be
鹵1.5
kV during product qualification. Industry standard
test method used was IEA/JESD22-A114. Adherence to ESD handling precautionary procedures is advised at all times.
All trademarks are the property of their respective owners.
鈥?/div>
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Copyright
錚?/div>
2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 1443
鈥?/div>
HOUSTON, TEXAS 77251鈭?443
1

TMS320C54V90BGGU 產(chǎn)品屬性

  • 160

  • 集成電路 (IC)

  • 嵌入式 - DSP（數(shù)字式信號(hào)處理器）

  • TMS320C54x

  • 定點(diǎn)

  • 主機(jī)接口，McBSP

  • 117MHz

  • ROM（256 kB）

  • 80kB

  • 3.30V

  • 1.50V

  • 0°C ~ 100°C

  • 表面貼裝

  • 144-LFBGA

  • 144-BGA MICROSTAR（12x12）

  • 托盤

  • 296-16933

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