鈾?/div>
High temperature soldering guaranteed:
260擄C/10 seconds at 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
0.052 (1.32)
0.048 (1.22)
DIA.
MECHANICAL DATA
1.0 (25.4)
MIN.
Case:
Molded epoxy body over passivated chip
Terminals:
Plated axial leads solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.07 ounces, 2.1 grams
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
SUF30G
SUF30J
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current,
0.200鈥?(5.0mm) lead length at T
A
=60擄C
Peak forward surge current, 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method) at T
A
=60擄C
Maximum instantaneous forward voltage at 3.0A
Maximum peak reverse current
at rated peak reverse voltage
Maximum reverse recovery time
(NOTE1)
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 3)
Operating junction and storage temperature range
T
A
=25擄C
T
A
=100擄C
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
t
rr
C
J
R
螛JA
T
J
,T
STG
400
280
400
3.0
80.0
1.80
10.0
100.0
35.0
60
25.0
-55 to +150
600
420
600
Volts
Volts
Volts
Amps
Amps
2.0
Volts
碌A
ns
pF
擄C/W
擄C
NOTES:
(1) Reverse recovery test condition: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.200" (5.0mm) lead length with both leads attached to heat sink
4/98
1
2
