Bourns Part No.
Tol. %
Ref.
Min.
鈩?/div>
(鈩?
0.040
0.055
0.065
0.080
0.100
0.120
0.140
0.160
0.180
0.200
0.240
0.260
0.280
0.380
0.440
0.550
0.600
0.750
0.90
1.05
1.18
1.40
1.80
2.10
2.25
3.00
3.40
4.00
5.00
I rms
Max.
(A)
2.50
2.10
1.95
1.75
1.50
1.40
1.30
1.20
1.10
1.00
0.92
0.84
0.75
0.68
0.60
0.54
0.50
0.45
0.40
0.35
0.30
0.27
0.24
0.22
0.20
0.18
0.17
0.16
0.15
I sat
Typ.
(A)
4.90
3.70
3.20
2.50
2.20
2.10
1.80
1.70
1.50
1.40
1.20
1.10
1.00
0.95
0.90
0.74
0.70
0.66
0.64
0.62
0.55
0.45
0.38
0.36
0.35
0.34
0.32
0.29
0.24
General Specifications
Test Voltage........................................1 V
Reflow soldering.....250 擄C; 10 sec max.
(In compliance with JEDEC,
J-STD-020C, Table 4-2)
Operating Temperature .-40 擄C to +125 擄C
(Temperature rise included)
Storage Temperature..-40 擄C to +125 擄C
Resistance to Soldering Heat
............................250 擄C, 10 sec. max.
Materials
Core ...................................Ferrite DR&RI
Wire .............................Enameled copper
Base ......................................LCP E4008
Terminal.....................................Cu/Ni/Sn
Rated Current
....................Ind. drop 10 % typ. at Isat
Temperature Rise
......................40 擄C max. at rated Irms
Packaging...................1000 pcs. per reel
Product Dimensions
101
8.0
鹵
0.2
(.315
鹵
.008)
10.5
鹵
0.1
(.413
鹵
.004)
4.7
MAX.
(.185)
Soldering Profile
300
<1> Max. of 10 seconds at 250 擄C
<2> Max. of 30 seconds > 220 擄C
250
6.0
(.236)
TYP.
250 擄C
<1>
2.1
TYP.
(.082)
200
<2>
Temperature (擄C)
2.0
TYP.
(.079)
150
120 - 150 seconds
100
DIMENSIONS:
Ramp-down
5 擄C/second maximum
MM
(INCHES)
Recommended Layout
50
Ramp-up
4 擄/second maximum
0
0
50
100
150
Time
(seconds)
200
250
300
5.7
(.224)
2.2
(.086)
2.5
(.099)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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