Bourns Part No.
Tol. %
Ref.
Min.
鈩?/div>
(鈩?
0.08
0.10
0.12
0.15
0.17
0.19
0.25
0.27
0.30
0.38
0.46
0.60
0.70
0.80
0.95
1.00
1.30
1.45
1.90
2.15
2.80
3.30
3.60
I rms
Max.
(A)
1.70
1.40
1.20
1.10
1.00
0.90
0.80
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.37
0.35
0.30
0.28
0.24
0.22
0.19
0.17
0.16
I sat
Typ.
(A)
2.80
2.60
2.20
1.90
1.60
1.50
1.30
1.30
1.10
1.00
0.95
0.85
0.80
0.73
0.65
0.55
0.50
0.45
0.40
0.35
0.32
0.30
0.28
General Specifications
Test Voltage........................................1 V
Reflow soldering.....250 擄C; 10 sec max.
(In compliance with JEDEC,
J-STD-020C, Table 4-2)
Operating Temperature .-40 擄C to +125 擄C
(Temperature rise included)
Storage Temperature..-40 擄C to +125 擄C
Resistance to Soldering Heat
............................250 擄C, 10 sec. max.
Materials
Core ...................................Ferrite DR&RI
Wire ............................Enamelled copper
Base ......................................LCP E4008
Terminal.....................................Cu/Ni/Sn
Rated Current
....................Ind. drop 10 % typ. at Isat
Temperature Rise
......................40 擄C max. at rated Irms
Packaging...................1000 pcs. per reel
Product Dimensions
101
8.0
鹵
0.2
(.315
鹵
.008)
Soldering Profile
300
10.5
鹵
0.1
(.413
鹵
.004)
<1> Max. of 10 seconds at 250 擄C
<2> Max. of 30 seconds > 220 擄C
3.8
MAX.
(.150)
250
250 擄C
<1>
200
<2>
Temperature (擄C)
6.0
(.236)
TYP.
2.1
TYP.
(.082)
150
120 - 150 seconds
100
Ramp-down
5 擄C/second maximum
2.0
TYP.
(.079)
50
Ramp-up
4 擄/second maximum
DIMENSIONS:
0
0
50
100
150
Time
(seconds)
200
250
300
MM
(INCHES)
Recommended Layout
5.7
(.224)
2.2
(.086)
2.5
(.099)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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