Bourns Part No.
Tol. %
Ref.
Min.
鈩?/div>
(鈩?
I rms
Max.
(A)
I sat
Typ.
(A)
SRR0604-1R5ML
SRR0604-2R5ML
SRR0604-3R3ML
SRR0604-4R7ML
SRR0604-6R8ML
SRR0604-100ML
SRR0604-150ML
SRR0604-220ML
SRR0604-330KL
SRR0604-470KL
SRR0604-680KL
SRR0604-101KL
SRR0604-151KL
SRR0604-221KL
SRR0604-331KL
SRR0604-471KL
SRR0604-681KL
SRR0604-102KL
1.5
2.5
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
330
470
680
1000
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
鹵
20
20
20
20
20
20
20
20
10
10
10
10
10
10
10
10
10
10
23
21
21
10
20
18
18
16
16
15
15
23
21
20
18
18
16
15
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
0.796
0.796
0.796
0.796
0.796
0.796
0.252
110.0
100.0
90.0
50.0
37.0
30.0
30.0
25.0
21.0
18.0
15.0
13.0
12.0
10.0
7.0
6.5
6.0
5.5
0.028
0.035
0.050
0.060
0.070
0.12
0.13
0.19
0.25
0.35
0.52
0.65
1.00
1.70
2.10
3.30
4.80
6.10
2.80
2.50
2.30
2.00
1.60
1.30
1.10
0.90
0.70
0.60
0.50
0.40
0.30
0.25
0.20
0.18
0.15
0.12
3.95
3.50
2.90
2.55
2.05
1.80
1.45
1.20
0.95
0.80
0.68
0.57
0.47
0.32
0.28
0.22
0.19
0.15
General Specifications
Test Voltage ....................................1 Volt
Reflow Soldering .....230 藲C; 50 sec max.
Operating Temperature .-40 擄C to +125 擄C
(Temperature rise included)
Storage Temperature..-40 擄C to +125 擄C
Resistance to Soldering Heat
..................................260 擄C for 5 sec.
Materials
Core Material...................Ferrite DR & RI
Wire ............................Enameled Copper
Base ......................................LCP E4008
Terminal.....................................Cu/Ni/Sn
Rated Current ..Ind. drop 10 % typ at I sat
Temperature Rise ..40 藲C max at rated I rms
Packaging...................1000 pcs. per reel
Product Dimensions
6.5
鹵0.2
(.256
鹵.008)
6.5
鹵
0.2
(.256
鹵.008)
MAX.
4.8
(.189)
Electrical Schematic
100
2.0
鹵0.2
(.099
鹵.008)
0.7
鹵0.1
(.028
鹵.004)
5.0
鹵0.2
(.197
鹵.008)
0.7
鹵0.1
(.028
鹵.004)
Recommended Layout
2.5
(.099)
4.5
(.177)
1.5
(.060)
DIMENSIONS:
MM
(INCHES)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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