CSP TVS
Flip Chip TVS Diode Array
PROTECTION PRODUCTS
Description
The SFC05-4 is a quad flip chip CSP TVS diode array.
They are state-of-the-art devices that utilize solid-state
silicon-avalanche technology for superior clamping
performance and DC electrical characteristics. The
SFC series TVS diodes are designed to protect sensi-
tive semiconductor components from damage or latch-
up due to electrostatic discharge (ESD) and other
voltage induced transient events.
The SFC05-4 is a 6-bump, 0.5mm pitch flip chip array
with a 3x2 bump grid. It measures 1.5 x 1.0 x
0.65mm. This small outline makes the SFC05-4
especially well suited for portable applications. CSP
TVS devices are compatible with current pick and place
equipment and assembly methods.
Each device will protect up to four data or I/O lines.
The CSP design results in lower inductance, virtually
eliminating voltage overshoot due to leads and inter-
connecting bond wires. They may be used to meet the
ESD immunity requirements of IEC 61000-4-2, Level 4
(15kV air, 8kV contact discharge).
SFC05-4
PRELIMINARY
Features
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300 Watts peak pulse power (tp = 8/20碌s)
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Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 24A (8/20碌s)
Small chip scale package requires less board space
Low profile (< 0.65mm)
No need for underfill material
Protects four I/O or data lines
Low clamping voltage
Working voltage: 5V
Solid-state silicon-avalanche technology
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Mechanical Characteristics
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JEDEC MO-211, Variation BB, 0.50 mm Pitch Chip
Scale Package (CSP)
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Marking : Marking Code
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Packaging : Tape and Reel
Applications
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Cell Phone Handsets and Accessories
Personal Digital Assistants (PDA聮s)
Notebook & Hand Held Computers
Portable Instrumentation
Pagers
Smart Cards
MP3 Players
GPS
Device Dimensions
1.50
Schematic & PIN Configuration
B
1.00
0.50
0.50
TYP
0.65
0.150
A
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SFC05-4 Maximum Dimensions (mm)
3 x 2 Grid CSP TVS (Bottom View)
www.semtech.com
Revision 12/18/2000
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