SPICE MODELS: RS3A RS3B RS3D RS3G RS3J RS3K RS3M RS3AB RS3BB RS3DB RS3GB RS3JB RS3KB RS3MB
RS3A/B - RS3M/B
3.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
Features
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Glass Passivated Die Construction
Fast Recovery Time for High Efficiency
Surge Overload Rating to 100A Peak
Ideally Suited for Automatic Assembly
Lead Free Finish/RoHS Compliant (Note 4)
A
B
Dim
SMB
Min
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
SMC
Min
5.59
6.60
2.75
0.15
7.75
0.10
0.76
2.00
Max
6.22
7.11
3.18
0.31
8.13
0.20
1.52
2.62
A
C
B
C
D
Mechanical Data
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Case: SMB, SMC
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
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Polarity: Cathode Band or Cathode Notch
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: SMB 0.093 grams (approx)
SMC 0.21 grams (approx)
D
J
E
G
H
H
G
E
J
All Dimensions in mm
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Suffix Designates SMC Package
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
RMS Reverse Voltage
Average Rectified Output Current
@ T
T
= 75擄C
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Forward Voltage
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
Maximum Recovery Time (Note 3)
Typical Total Capacitance (Note 2)
Typical Thermal Resistance Junction to Terminal (Note 1)
Operating and Storage Temperature Range
@ I
F
= 3.0A
@ T
A
= 25擄C
@ T
A
= 125擄C
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
RM
t
rr
C
T
R
qJT
T
j,
T
STG
RS3
A/AB
50
35
@ T
A
= 25擄C unless otherwise specified
RS3
B/BB
100
70
RS3
D/DB
200
140
RS3
G/GB
400
280
3.0
100
1.3
5.0
250
RS3
J/JB
600
420
RS3
K/KB
800
560
RS3
M/MB
1000
700
Unit
V
V
A
A
V
mA
150
50
25
-65 to +150
250
500
ns
pF
擄C/W
擄C
Notes:
1.
2.
3.
4.
5.
Thermal resistance: junction to terminal, unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pad as heat sink.
Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
Reverse recovery test conditions: I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See figure 5.
RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see
EU Directive Annex Notes 5 and 7.
Short duration pulse test used to minimize self-heating effect.
DS15005 Rev. 8 - 2
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RS3A/B - RS3M/B
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Diodes Incorporated
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