鈾?/div>
High temperature soldering guaranteed:
250擄C/10 seconds 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
0.100 (2.54)
0.090 (2.29)
DIA
1.0 (25.4)
MIN.
0.125 (3.18)
0.115 (2.92)
MECHANICAL DATA
1.0 (25.4)
MIN.
0.025 (0.635)
0.023 (0.584)
DIA.
Dimensions are in inches and (millimeters)
Case:
Molded plastic over passivated chip
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.0064 ounce, 0.181 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
RMPG
06A
RMPG
06B
RMPG
06D
RMPG
06G
RMPG
06J
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current,
0.375" (9.5mm) lead length at T
A
=25擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Typical junction capacitance
Typical reverse recovery time
Typical thermal resistance
(NOTE 1)
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
70
200
140
200
1.0
400
280
400
600
420
600
Volts
Volts
Volts
Amp
I
FSM
V
F
I
R
C
J
t
rr
40.0
1.3
5.0
50.0
6.6
150
67.0
30.0
-55 to +150
200
Amps
Volts
碌A(chǔ)
pF
ns
擄C/W
擄C
T
A
=25擄C
T
A
=125擄C
(NOTE 3)
R
螛JA
R
螛JL
T
J
, T
STG
Operating junction and storage temperature range
NOTES:
(1) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(2) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(3) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length,
P.C.B. mounted with 0.22 x 0.22鈥?(5.5 x 5.5mm) copper pads
4/98
VISHAY
1
2
