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High temperature soldering guaranteed:
350擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
P
A
T
E
N
T
E
1.0 (25.4)
MIN.
0.210 (5.3)
0.190 (4.8)
DIA.
0.375 (9.5)
0.285 (7.2)
0.052 (1.32)
0.048 (1.22)
DIA.
1.0 (25.4)
MIN.
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No 3,930,306
廬
MECHANICAL DATA
Case:
JEDEC DO-201AD molded plastic over glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.04 ounce, 1.12 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
RGP
25A
RGP
25B
RGP
25D
RGP
25G
RGP
25J
RGP
25K
RGP
25M
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55擄C
Peak forward surge current 8.3ms single half sine-
wave superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 2.5A
Maximum DC reverse current
at rated DC blocking voltage
T
A
=25擄C
T
A
=125擄C
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
I
R
t
rr
C
J
R
螛JA
T
J
, T
STG
50
35
50
100
70
100
200
140
200
400
280
400
2.5
100.0
1.3
5.0
200.0
100.0
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amps
Amps
Volts
碌A(chǔ)
碌A(chǔ)
Maximum full load reverse current, full cycle average
0.375" (9.5mm) lead length at T
A
=55擄C
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 3)
150
60.0
20.0
-65 to +175
250
500
ns
pF
擄C/W
擄C
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
4/98
VISHAY
1
2
