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High temperature soldering guaranteed:
350擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
P
A
T
E
N
T
E
1.0 (25.4)
MIN.
0.107 (2.7)
0.080 (2.0)
DIA.
0.205 (5.2)
0.160 (4.1)
1.0 (25.4)
MIN.
0.026 (0.66)
0.023 (0.58)
DIA.
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
MECHANICAL DATA
Case:
Molded plastic over glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.012 ounce, 0.3 gram
廬
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
RGP02
-12E
RGP02
-14E
RGP02
-16E
RGP02
-18E
RGP02
-20E
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at TA=55擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 0.1A
Maximum DC reverse current
at rated DC blocking voltage
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 3)
Operating junction and storage temperature range
T
A
=25擄C
T
A
=125擄C
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
t
rr
C
J
R
螛JA
R
螛JL
T
J,
T
STG
1200
840
1200
1400
980
1400
1600
1120
1600
0.5
20.0
1.8
5.0
50.0
300.0
5.0
65.0
30.0
-65 to +175
1800
1260
1800
2000
1400
2000
Volts
Volts
Volts
Amp
Amps
Volts
碌A(chǔ)
ns
pF
擄C/W
擄C
Maximum reverse recovery time
(NOTE 1)
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length, P.C.B. mounted
4/98
VISHAY
1
2
