SPICE MODEL: PDS835L
PDS835L
8A LOW VF SCHOTTKY BARRIER RECTIFIER
PowerDI
盲
5
Features
NEW PRODUCT
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Guard Ring Die Construction for
Transient Protection
Low Forward Voltage Drop
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Applications
High Forward Surge Current Capability
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
L1
L1
D
b2
A
A2
PowerDI
盲
5
E
E1
Dim
A
A2
Min
1.05
0.33
0.80
1.70
3.90
6.40
5.30
0.75
0.50
1.20
Max
1.15
0.43
0.99
1.88
4.05
6.60
5.45
0.95
0.65
1.50
e
b1
D
D2
b2
L
E2
E
b1
A2
b1
b2
D
D2
E
e
E1
E2
L
L1
Mechanical Data
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Case: PowerDI
盲
5
Case Material: Molded Plastic, 鈥淕reen鈥?Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish 鈥?Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Marking: See Page 3
Weight: 0.094 grams (approximate)
W
3.05 NOM
1.84 NOM
3.55 NOM
L1
e
e
3
b1
LEFT PIN
RIGHT PIN
b1
BOTTOMSIDE
HEAT SINK
W
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
All Dimensions in mm
Maximum Ratings
@ T
A
= 25擄C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See also figure 5)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Operating Temperature Range
Storage Temperature Range
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
T
j
T
STG
Value
35
25
8
120
-65 to +125
-65 to +150
Unit
V
V
A
A
擄C
擄C
Thermal Characteristics
Characteristic
@ T
A
= 25擄C unless otherwise specified
Symbol
R
qJS
R
qJA
R
qJA
R
qJA
Typ
戮
100
65
45
Max
3.0
戮
戮
戮
Unit
擄C/W
擄C/W
擄C/W
擄C/W
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
Notes:
1.
2.
3.
4.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30488 Rev. 7 - 2
PowerDI is a trademark of Diodes Incorporated.
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PDS835L
茫
Diodes Incorporated
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