SPICE MODEL: PDS5100
PDS5100
5A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER
PowerDI
盲
5
Features
NEW PRODUCT
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Guard Ring Die Construction for
Transient Protection
High Surge Current Capability
Low Leakage Current
Low Forward Voltage Drop
High Forward Surge Current Capability
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
b1
L1
L1
D
b2
A
A2
PowerDI
盲
5
E
Dim
E1
Min
1.05
0.33
0.80
1.70
3.90
6.40
5.30
0.75
0.50
1.20
Max
1.15
0.43
0.99
1.88
4.05
6.60
5.45
0.95
0.65
1.50
A
A2
b1
e
b1
D
D2
b2
L
E2
E
A2
b2
D
D2
E
e
E1
E2
L
L1
Mechanical Data
Case: PowerDI
盲
5
Case Material: Molded Plastic, 鈥淕reen鈥?Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish 鈥?Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
e
3
Polarity: See Diagram
Marking: See Page 3
Weight: 0.093 grams (approximate)
b1
LEFT PIN
RIGHT PIN
3.05 NOM
1.84 NOM
3.55 NOM
W
L1
e
b1
BOTTOMSIDE
HEAT SINK
W
All Dimensions in mm
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
Maximum Ratings
@ T
A
= 25擄C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See also figure 5)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Operating Temperature Range
Storage Temperature Range
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
T
j
T
STG
Value
100
71
5
120
-65 to +150
-65 to +175
Unit
V
V
A
A
擄C
擄C
Thermal Characteristics
Characteristic
@ T
A
= 25擄C unless otherwise specified
Symbol
R
qJS
R
qJA
R
qJA
R
qJA
Typ
1.3
90
70
50
Max
2.6
戮
戮
戮
Unit
擄C/W
擄C/W
擄C/W
擄C/W
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
Notes:
1.
2.
3.
4.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30483 Rev. 6 - 2
PowerDI is a trademark of Diodes Incorporated.
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PDS5100
茫
Diodes Incorporated
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