SPICE MODEL: PDS4150
PDS4150
4A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER
PowerDI
盲
5
Features
NEW PRODUCT
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Guard Ring Die Construction for Transient Protection
Low Forward Voltage Drop
Very Low Leakage Current
High Maximum Junction Temperature Capability
Highly Stable Oxide Passivated Junction
High Forward Surge Current Capability
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
b1
D
D2
b2
L
E2
E
E
D
b2
L1
A
A2
PowerDI
盲
5
Dim
E1
Min
1.05
0.33
0.80
1.70
3.90
6.40
5.30
0.75
0.50
1.20
Max
1.15
0.43
0.99
1.88
4.05
6.60
5.45
0.95
0.65
1.50
A
A2
b1
L1
e
b1
A2
b2
D
D2
E
e
E1
E2
L
L1
Mechanical Data
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Case: PowerDI
盲
5
Case Material: Molded Plastic, 鈥淕reen鈥?Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish 鈥?Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
e
3
Polarity: See Diagram
Ordering Information (See Page 3)
Marking: Type Number (See Page 3)
Weight: 0.096 grams (approximate)
LEFT PIN
RIGHT PIN
3.05 NOM
1.84 NOM
3.55 NOM
W
L1
e
b1
b1
BOTTOMSIDE
HEAT SINK
W
All Dimensions in mm
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
Maximum Ratings
@ T
A
= 25擄C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See also figure 4)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Operating Temperature Range
Storage Temperature Range
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
T
j
T
STG
@ T
A
= 25擄C unless otherwise specified
Symbol
R
qJS
R
qJA
R
qJA
R
qJA
Typ
戮
90
60
40
Max
2.0
戮
戮
戮
Unit
擄C/W
擄C/W
擄C/W
擄C/W
Value
150
106
4
180
-65 to +175
-65 to +175
Unit
V
V
A
A
擄C
擄C
Thermal Characteristics
Characteristic
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
Notes:
1.
2.
3.
4.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4 mm x 7.2 mm. Anode pad dimensions 2.7 mm x 1.6 mm.
DS30473 Rev. 8 - 2
PowerDI is a trademark of Diodes Incorporated.
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www.diodes.com
PDS4150
茫
Diodes Incorporated
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