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Hermetic Surface Mount Package
Very Low Forward Voltage
Very Fast Recovery Time
Low Thermal Resistance
Isolated Package
High Surge
Center-Tap Configuration
Available Screened To MIL-S-19500, TX, TXV And S Levels
DESCRIPTION
This series of products in a hermetic surface mount package is specifically designed
for use at power switching frequencies in excess of 100 kHz. The series combines
two high efficiency devices into one package, simplifying installation, reducing heat
sink hardware, and the need to obtain matched components. These devices are
ideally suited for Military applications where small size and a hermetically sealed
package are required. Common cathode is standard.
ABSOLUTE MAXIMUM RATINGS
(Per Diode) T
C
= 25擄C
Peak Inverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 to 200 V
Maximum Average D.C. Output Current @ T
C
= 100擄 C. . . . . . . . . . . . . . . . . . . . . . 10 A
Surge Current (Non-Repetitive 8.3 msec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 A
Thermal Resistance, Junction-to-Case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2擄 C/W
Operating and Storage Temperature Range . . . . . . . . . . . . . . . . . . . - 55擄 C to +150擄 C
Max. Lead Solder Temperature for 5 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225擄 C
3.2
SCHEMATIC
2
1
1
2
2
1
1
2
3
OMXXXXRM
1
1
COMMON
ANODE
3
3
2
3
COMMON
CATHODE
OMXXXXSM
DOUBLER
3
2
OMXXXXDM
Common cathode is standard. Contact factory for performance characteristics for common anode and doubler.
For additional test conditions and limits, see Sect. 3.5, pg. 3.5 - 71.
4 11 R0
3.2 - 53
1
