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Rugged Package Design
Very Low Forward Voltage
Very Fast Switching Time
High Current
Center-Tap Configuration
Low Thermal Resistance
Common Cathode Standard
Ceramic Feedthroughs Available
Available Screened To MIL-S-19500, TX, TXV And S Levels
DESCRIPTION
This series of products in a hermetic package is specifically designed for use at
power switching frequencies in excess of 100 kHz. The series combines the latest
silicon technology and a package specifically designed for high efficiency/high current
applications. These devices are ideally suited for applications where small size and a
hermetically sealed package are required.
ABSOLUTE MAXIMUM RATINGS
(Per Diode) @ 25擄C
Peak Inverse Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 to 800 V
Maximum Average D.C. Output Current @ T
C
= 100擄 C . . . . . . . . . . . . . . . . . . . . . . 50 A
Surge Current (Non-Repetitive 8.3 ms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 700 A
Thermal Resistance, Junction-to-Case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0擄C/W
Operating and Storage Temperature Range . . . . . . . . . . . . . . . . . . . . - 55擄 C to + 150擄C
3.2
SCHEMATIC
1
2
COMMON
ANODE
1
2
OMXXXXXXDB
Common cathode is standard. Contact factory for performance
characteristics for common anode and doubler.
PIN CONNECTION
2
COMMON
CATHODE
OMXXXXXXCB
1
3
OMXXXXXXRB
3
3
DOUBLER
1
2
3
4 11 R0
3.2 - 1
1
2
