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NXT-PA Datasheet

  • NXT-PA

  • I/O Card Interface Connectors

  • 15頁

  • HRS

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I/O Card Interface Connectors
NX Series
3. ESD Secure
Thermoplastic molded covers assures insulation
of the connections and shields from ESD.
4. Secure Latching
A built-in latch assures correct and secure
mating of connector.
5. Reliable Conductor Termination
Reliable termination of conductors
accomplished by proven IDC termination.
is
6. Sequential Mating
The 0.8mm pitch contacts are engaging the
corresponding parts in sequence: Ground-
Power & Signal
7. Rugged Construction
sFeatures
1. Low Profile
Protorusion above the PCB board is only 2.9mm, and the
connectors can be mounted to type I and II I/O cards.
Securely attached to the board with optional
screws.
8. Card Frame Kits
Available as a separate part number.
2. EMI/RFI protection
Full metal shielding. Shield connects first, ahead of
contacts.
9. Secure Attachment to Frame Kit.
Compliant mounting bracket attaches the
connectore directly to the frame kit.
sApplications
Used with I/O cards, portable personal computers,and the external connections of various small-sized portable
terminals.
sSpecifications
Current rating 0.5 A
Ratings
Voltage rating 125 V AC
Item
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Vibration
Operating temperature
Operating humidity
-30莽 to +70莽 (Note 1) Storage temperature range -10莽 to +60莽 (Note 2)
95% R.H. or less
(No condensation)
Specification
250 M ohms min.
No flashover or insulation breakdown.
40 m ohms max.
No electrical discontinuity of 10碌s or
more
100 V DC
300 V AC / 1 minute
100 mA
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,
2 hours in each of the 3 directions.
96 hours at temperature of 60莽 and humidity of 90% to 95%
-55莽, 30 min./15 to 30莽, within 5 min/85莽, 30 min
/15
to 35莽, within 5 min, for 5 cycles
3000 cycles
Storage humidity range
Conditions
40 to 70% (Note 2)
5. Humidity (Steady state)
Insulation resistance: 100 M ohms min.
6. Temperature cycle
7. Durability
(Insertion/withdrawal)
8. Resistance to
Soldering heat
No damage, cracks, or parts looseness.
60 m ohms max.
No deformation of components affecting
Reflow: At the recommended temperature profile
performance.
Manual soldering: 300莽 for 3 seconds
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature
Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during
transportation.
B8

NXT-PA 產(chǎn)品屬性

  • Hirose Electric

  • 1

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