鈮?/div>
10
ms)
Total Power Dissipation @ T
A
= 25擄C
Operating and Storage Temperature Range
Thermal Resistance 鈭?Junction鈭抰o鈭扐mbient
Maximum Lead Temperature for Soldering
Purposes, (1/8鈥?from case for 10 s)
Symbol
V
DSS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
R
qJA
T
L
Value
鈭?0
鹵12
鈭?.3
鈭?.0
400
鈭?55 to
150
300
260
Unit
V
V
A
A
mW
擄C
擄C/W
擄C
1
2
SOT鈭?3
CASE 318
STYLE 21
3
G
P鈭扖hannel
D
S
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
PO2W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1
Gate
2
Source
PO2 = Specific Device Code
W
= Work Week
ORDERING INFORMATION
Device
NTR1P02LT1
NTR1P02LT1G
NTR1P02LT3
NTR1P02LT3G
Package
SOT鈭?3
SOT鈭?3
(Pb鈭扚ree)
SOT鈭?3
SOT鈭?3
(Pb鈭扚ree)
Shipping
鈥?/div>
3000 Tape & Reel
3000 Tape & Reel
10,000 Tape & Reel
10,000 Tape & Reel
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2004
1
July, 2004 鈭?Rev. 5
Publication Order Number:
NTR1P02LT1/D
next