Thermal Resistance 鈭?/div>
Junction鈭抰o鈭扐mbient (Note 1)
Junction鈭抰o鈭扐mbient (Note 2)
Symbol
V
DSS
V
GS
I
D
I
D
I
DM
P
D
Value
鈭?0
"12
鈭?.5
鈭?.4
"30
0.93
W
1
A
I
D
I
D
I
DM
P
D
T
J
, T
stg
E
AS
鈭?.8
鈭?.4
"30
1.39
鈭?5 to
+150
845
W
擄C
mJ
D
S
S
G
463
Y
WW
N
= Device Code
= Year
= Work Week
= MOSFET
Unit
V
V
A
8
TSSOP鈭?
CASE 948S
PLASTIC
S
MARKING
DIAGRAM
463
YWW
N
PIN ASSIGNMENT
1
2
3
4
Top View
8
7
6
5
D
S
S
D
R
qJA
134
90
擄C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Minimum 3鈥?X 3鈥?FR鈭? board, steady state.
2. Mounted on 1鈥?square (1 oz.) board, steady state.
3. Pulse Test: Pulse Width = 300
ms,
Duty Cycle = 2%.
ORDERING INFORMATION
Device
NTQS6463
NTQS6463R2
Package
TSSOP鈭?
TSSOP鈭?
Shipping
鈥?/div>
100 Units/Rail
3000/Tape & Reel
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2004
1
September, 2004 鈭?Rev. 2
Publication Order Number:
NTQS6463/D
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