鈥?/div>
Power Management in Portable and Battery鈭扨owered Products, i.e.:
Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS
(T
J
= 25擄C unless otherwise noted)
Rating
Drain鈭抰o鈭扴ource Voltage
Gate鈭抰o鈭扴ource Voltage 鈭?Continuous
Thermal Resistance
Junction鈭抰o鈭扐mbient (Note 1)
Total Power Dissipation @ T
A
= 25擄C
Drain Current 鈭?Continuous @ T
A
= 25擄C
鈭?Pulsed Drain Current (T
p
t
10
mS)
Thermal Resistance
Junction鈭抰o鈭扐mbient (Note 2)
Total Power Dissipation @ T
A
= 25擄C
Drain Current 鈭?Continuous @ T
A
= 25擄C
鈭?Pulsed Drain Current (T
p
t
10
mS)
Thermal Resistance
Junction鈭抰o鈭扐mbient (Note 3)
Total Power Dissipation @ T
A
= 25擄C
Drain Current 鈭?Continuous @ T
A
= 25擄C
鈭?Pulsed Drain Current (T
p
t
10
mS)
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering
Purposes for 10 Seconds
Symbol
V
DSS
V
GS
R
qJA
P
d
I
D
I
DM
R
qJA
P
d
I
D
I
DM
R
qJA
P
d
I
D
I
DM
T
J
, T
stg
T
L
Value
鈭?0
"8.0
244
0.5
鈭?.65
鈭?0
128
1.0
鈭?.35
鈭?4
62.5
2.0
鈭?.3
鈭?0
鈭?5 to 150
260
Unit
V
V
3
4
擄C/W
W
A
A
擄C/W
W
A
A
擄C/W
W
A
A
擄C
擄C
TSOP鈭?
CASE 318G
STYLE 1
1
= Device Code
= Work Week
MARKING
DIAGRAM
PT
W
1
PT
W
PIN ASSIGNMENT
Drain Drain Source
6 5 4
1. Minimum FR鈭? or G鈭?0PCB, operating to steady state.
2. Mounted onto a 2鈥?square FR鈭? board (1鈥?sq. 2 oz. cu. 0.06鈥?thick single
sided), operating to steady state.
3. Mounted onto a 2鈥?square FR鈭? board (1鈥?sq. 2 oz. cu. 0.06鈥?thick single
sided), t
t
5.0 seconds.
1
2
3
Drain Drain Gate
ORDERING INFORMATION
Device
NTGS3441T1
NTGS3441T1G
Package
TSOP鈭?
Shipping
鈥?/div>
3000 / Tape & Reel
TSOP鈭? 3000 / Tape& Reel
(Pb鈭扚ree)
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2004
1
April, 2004 鈭?Rev. 4
Publication Order Number:
NTGS3441T1/D
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