鈥?/div>
Pb鈭扚ree Packages are Available
Lower R
DS(on)
Lower V
DS(on)
Tighter V
SD
Specification
Lower Diode Reverse Recovery Time
Lower Reverse Recovery Stored Charge
Power Supplies
Converters
Power Motor Controls
Bridge Circuits
Typical Applications
G
S
MAXIMUM RATINGS
(T
J
= 25擄C unless otherwise noted)
Rating
Drain鈭抰o鈭扴ource Voltage
Drain鈭抰o鈭扜ate Voltage (R
GS
= 10 MW)
Gate鈭抰o鈭扴ource Voltage, Continuous
鈭?Non鈭扲epetitive (t
p
v10
ms)
Drain Current
鈭?Continuous @ T
A
= 25擄C
鈭?Continuous @ T
A
= 100擄C
鈭?Single Pulse (t
p
v10
ms)
Total Power Dissipation @ T
A
= 25擄C
Derate above 25擄C
Total Power Dissipation @ T
A
= 25擄C (Note 1)
Total Power Dissipation @ T
A
= 25擄C (Note 2)
Operating and Storage Temperature Range
Single Pulse Drain鈭抰o鈭扴ource Avalanche
Energy 鈭?Starting T
J
= 25擄C
(V
DD
= 25 Vdc, V
GS
= 5.0 Vdc, L = 1.0 mH
I
L(pk)
= 11 A, V
DS
= 60 Vdc)
Thermal Resistance, 鈭?Junction鈭抰o鈭扖ase
鈭?Junction鈭抰o鈭扐mbient (Note 1)
鈭?Junction鈭抰o鈭扐mbient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8鈥?from case for 10 seconds
Symbol
V
DSS
V
DGR
V
GS
V
GS
I
D
I
D
I
DM
P
D
Value
60
60
"15
"20
12
10
45
48
0.32
2.1
1.5
鈭?5 to
+175
61
Unit
Vdc
Vdc
Vdc
1 2
3
Adc
Apk
W
W/擄C
W
W
擄C
mJ
4
DPAK
CASE 369C
STYLE 2
MARKING
DIAGRAMS
4
Drain
AYW
55L104
2
1
3
Drain
Gate
Source
4
Drain
4
AYW
55L104
1 2 3
Gate Drain Source
55L104
A
Y
W
= Device Code
= Assembly Location
= Year
= Work Week
DPAK鈭?
CASE 369D
STYLE 2
1
2
T
J
, T
stg
E
AS
3
R
qJC
R
qJA
R
qJA
T
L
3.13
71.4
100
260
擄C/W
擄C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 1鈥?pad size,
(Cu Area 1.127 in
2
).
2. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu Area 0.412 in
2
).
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
漏
Semiconductor Components Industries, LLC, 2004
1
August, 2004 鈭?Rev. 4
Publication Order Number:
NTD3055L104/D