鈭?/div>
Junction鈭抰o鈭扐mbient (Note 2)
Maximum Lead Temperature for Soldering Pur-
poses, 1/8鈥?from case for 10 seconds
Symbol
V
DSS
V
DGR
V
GS
V
GS
I
D
I
D
I
D
Value
60
60
"20
"30
24
27
19
80
62.5
0.42
1.88
1.36
鈭?5
to
+175
162
Unit
Vdc
Vdc
Vdc
S
G
MARKING DIAGRAMS
Adc
Adc
Adc
Apk
W
W/擄C
W
W
擄C
mJ
4
1 2
4
Drain
YWW
24N06
2
1
3
Drain
Gate
Source
4
Drain
YWW
24N06
2
1 2 3
Gate Drain Source
= Device Code
= Year
= Work Week
24N06
Y
WW
Publication Order Number:
NTD24N06/D
I
DM
P
D
T
J
, T
stg
E
AS
3
DPAK
CASE 369C
Style 2
4
R
qJC
R
qJA
R
qJA
T
L
2.4
80
110
260
擄C/W
1
擄C
3
DPAK
CASE 369D
Style 2
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR鈭? board using the 0.5 sq in drain pad size.
2. When surface mounted to an FR鈭? board using the minimum recommended
pad size.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
錚?/div>
Semiconductor Components Industries, LLC, 2005
January, 2005
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