鈥?/div>
Pb鈭扚ree Packages are Available
Ultra鈭扡ow R
DS(on)
, Single Base, Advanced Technology
SPICE Parameters Available
Diode is Characterized for use in Bridge Circuits
I
DSS
and V
DS(on)
Specified at Elevated Temperatures
High Avalanche Energy Specified
ESD JEDAC rated HBM Class 1, MM Class A, CDM Class 0
Power Supplies
Inductive Loads
PWM Motor Controls
Replaces MTD20N03L in many Applications
20 A, 30 V, R
DS(on)
= 27 mW
N鈭扖hannel
D
G
S
Typical Applications
MARKING
DIAGRAMS
4
Drain
Value
30
30
"20
"24
20
16
60
74
0.6
1.75
鈭?5 to
150
288
Adc
Apk
W
W/擄C
W
擄C
mJ
1
2
4
AYWW
20
N3L
1 2 3
Gate Drain Source
20N3L
A
Y
WW
= Device Code
= Assembly Location
= Year
= Work Week
DPAK鈭?
CASE 369D
STYLE 2
Unit
Vdc
Vdc
Vdc
1 2
3
2
1
3
Drain
Gate
Source
4
Drain
AYWW
20
N3L
4
DPAK
CASE 369C
STYLE 2
MAXIMUM RATINGS
(T
C
= 25擄C unless otherwise noted)
Rating
Drain鈭抰o鈭扴ource Voltage
Drain鈭抰o鈭扜ate Voltage (R
GS
= 1.0 MW)
Gate鈭抰o鈭扴ource Voltage
鈭?Continuous
鈭?Non鈭扲epetitive (t
p
v10
ms)
Drain Current
鈭?Continuous @ T
A
= 25_C
鈭?Continuous @ T
A
= 100_C
鈭?Single Pulse (t
p
v10
ms)
Total Power Dissipation @ T
A
= 25_C
Derate above 25擄C
Total Power Dissipation @ T
C
= 25擄C (Note 1)
Operating and Storage Temperature Range
Single Pulse Drain鈭抰o鈭扴ource Avalanche
Energy 鈭?Starting T
J
= 25擄C
(V
DD
= 30 Vdc, V
GS
= 5 Vdc, L = 1.0 mH,
I
L(pk)
= 24 A, V
DS
= 34 Vdc)
Thermal Resistance
鈭?Junction鈭抰o鈭扖ase
鈭?Junction鈭抰o鈭扐mbient
鈭?Junction鈭抰o鈭扐mbient (Note 1)
Maximum Lead Temperature for Soldering
Purposes, 1/8鈥?from case for 10 seconds
Symbol
V
DSS
V
DGR
V
GS
V
GS
I
D
I
D
I
DM
P
D
T
J
, T
stg
E
AS
3
擄C/W
R
qJC
R
qJA
R
qJA
T
L
1.67
100
71.4
260
擄C
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended
pad size and repetitive rating; pulse width limited by maximum junction
temperature.
漏
Semiconductor Components Industries, LLC, 2004
1
August, 2004 鈭?Rev. 2
Publication Order Number:
NTD20N03L27/D
1
2
3
4
5
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