鈥?/div>
6
54
23
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
Available in 8 mm, 7 inch Tape and Reel
Lead Free Solder Plating
1
SOT鈭?63
CASE 463A
PLASTIC
MAXIMUM RATINGS
(T
A
= 25擄C unless otherwise noted, common for Q
1
and Q
2
, 鈭?minus sign for Q
1
(PNP) omitted)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
Symbol
V
CBO
V
CEO
I
C
Value
50
50
100
Unit
Vdc
Vdc
mAdc
MARKING DIAGRAM
xx D
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Total Device Dissipation
Derate above 25擄C
Thermal Resistance Junction-to-Ambient
Characteristic
(Both Junctions Heated)
Total Device Dissipation
Derate above 25擄C
Thermal Resistance Junction-to-Ambient
Junction and Storage Temperature
1. FR鈭? @ Minimum Pad
R
qJA
T
J
, T
stg
T
A
= 25擄C
R
qJA
T
A
= 25擄C
Symbol
P
D
Max
357
(Note 1)
2.9
(Note 1)
350
(Note 1)
Max
500
(Note 1)
4.0
(Note 1)
250
(Note 1)
鈭?5 to
+150
Unit
mW
mW/擄C
擄C/W
xx = Specific Device Code
(see table on page 2)
D = Date Code
ORDERING INFORMATION
Device
Package
Shipping
4 mm pitch
4000/Tape & Reel
2 mm pitch
8000/Tape & Reel
NSBC114EPDXV6T1 SOT鈭?63
NSBC114EPDXV6T5 SOT鈭?63
Unit
mW
Symbol
P
D
DEVICE MARKING INFORMATION
mW/擄C
擄C/W
擄C
Preferred
devices are recommended choices for future use
and best overall value.
See specific marking information in the device marking table
on page 2 of this data sheet.
漏
Semiconductor Components Industries, LLC, 2004
1
January, 2004 鈭?Rev. 3
Publication Order Number:
NSBC114EPDXV6/D