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NIS3001

Integrated Driver and

MOSFET Power Chip for

Synchronous Buck

Controllers

The NIS3001 is an integrated multi鈭抍hip solution for high power

DC to DC synchronous buck converters. It contains two power

MOSFETs that are controlled by an internal Driver. All three die are

packaged in a power QFN package called PInPAK鈩? The 10.5 by

10.5 mm PInPAK鈩?package increases power density and simplifies

PCB layout. The device can be used in single or multi鈭抪hase

applications.

The NIS3001 implements the newest MOSFET technology. The

control MOSFET is designed to provide improved switching

performance and operates at a much lower temperature compared to

discrete solutions. The synchronous MOSFET is designed to reduce

conduction and switching losses at high frequencies. The integrated

solution greatly reduces the parasitic inductance associated with

conventional discrete buck converters and results in the highest

power conversion efficiency.

The power density of the NIS3001 is optimized based on MOSFET

die size and PInPAK design. The PInPAK layout allows for direct

routing into each power terminal. This results in a better thermal

solution for the system. In addition its thermal resistance is 50%

lower than BGAs. In summary, the NIS3001 has an improved

efficiency, reliability and scalability for multi鈭抪hase synchronous

buck converters.

Features

http://onsemi.com

MARKING

DIAGRAM

CASE 500

PInPAK

10.5x10.5 PLLP

NIS3001QP

AWLYYWW

NIS3001 = Specific Device Code

A

= Assembly Site

WL = Wafer Lot

YY = Year

WW = Work Week

PINOUT DIAGRAM

14 15 16 17

11

12

13

18

19

20

10

7

5

9

8

21

1

2

3

4

鈥?/div>

Matched MOSFETs for Optimal Efficiency

10.5 mm x 10.5 mm Power QFN Package, PInPAK

25 A DC Output Current

7.0 to 14 V Input Voltage Range

Internal Thermal Shutdown

Operating Frequency Range up to 1,000 kHz

0.7 V to 5.1 V Output Voltage Range

Nominal Duty鈭扖ycle 5% to 50%

Hi Side

Discrete

FETs

Lo Side

Discrete

FETs

6

(Bottom View)

ORDERING INFORMATION

Device

NIS3001QPT1

Package

PInPAK

Shipping

鈥?/div>

1500/T

ape & Reel

VIN

VS

Analog

Driver

IC

DRN

鈥燜or information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

PGND

Figure 1.

漏

Semiconductor Components Industries, LLC, 2003

1

October, 2003 鈭?Rev. 5

Publication Order Number:

NIS3001/D

型號

版本

描述

廠商

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NIS3001QPT1

NIS3001QPT1 Datasheet

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