鈥?/div>
Short Circuit Protection/Current Limit
Thermal Shutdown with Automatic Restart
I
DSS
Specified at Elevated Temperature
Avalanche Energy Specified
Slew Rate Control for Low Noise Switching
Overvoltage Clamped Protection
Pb鈭扚ree Packages are Available
ESD Protection
Temperature
Limit
Current
Limit
Current
Sense
Source
MAXIMUM RATINGS
(T
J
= 25擄C unless otherwise noted)
Rating
Drain鈭抰o鈭扴ource Voltage Internally Clamped
Gate鈭抰o鈭扴ource Voltage
Drain Current
Continuous
Total Power Dissipation
@ T
A
= 25擄C (Note 1)
@ T
A
= 25擄C (Note 2)
Thermal Resistance
Junction鈭抰o鈭扖ase
Junction鈭抰o鈭扐mbient (Note 1)
Junction鈭抰o鈭扐mbient (Note 2)
Single Pulse Drain鈭抰o鈭扴ource Avalanche Energy
(V
DD
= 25 Vdc, V
GS
= 5.0 Vdc,
V
DS
= 40 Vdc, I
L
= 3.2 Apk, L = 120 mH,
R
G
= 25
W)
Operating and Storage Temperature Range
(Note 3)
Symbol
V
DSS
V
GS
I
D
P
D
1.25
1.9
擄C/W
R
qJC
R
qJA
R
qJA
E
AS
12
100
65
400
mJ
Value
42
"14
Unit
Vdc
Vdc
1
2
3
4
SOT鈭?23
CASE 318E
STYLE 3
Internally Limited
W
MARKING DIAGRAM
1
GATE
AYW
5003N
G
G
2
DRAIN
3
SOURCE
4
DRAIN
T
J
, T
stg
鈭?5 to 150
擄C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings
are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended
Operating Conditions may affect device reliability.
1. Surface mounted onto minimum pad size (0.412鈥?square) FR4 PCB, 1 oz cu.
2. Mounted onto 1鈥?square pad size (1.127鈥?square) FR4 PCB, 1 oz cu.
3. Normal pre鈭抐ault operating range. See thermal limit range conditions.
A
= Assembly Location
Y
= Year
W
= Work Week
5003N = Specific Device Code
G
= Pb鈭扚ree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2006
1
April, 2006 鈭?Rev. 2
Publication Order Number:
NIF5003N/D