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MURHF860CT_06 Datasheet

  • MURHF860CT_06

  • ULTRAFAST RECTIFIER 8.0 AMPERES, 600 VOLTS

  • 3頁

  • ONSEMI

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MURHF860CT
Preferred Device
SWITCHMODEt
Power Rectifier
These state-of-the-art SWITCHMODE power rectifiers are
designed for use in switching power supplies, inverters and as free
wheeling diodes.
Features
http://onsemi.com
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Ultrafast 35 Nanosecond Recovery Times
150擄C Operating Junction Temperature
Electrically Isolated. No Isolation Hardware Required
Epoxy Meets UL 94 V鈭? @ 0.125 in
High Temperature Glass Passivated Junction
High Voltage Capability to 600 V
Low Leakage Specified @ 150擄C Case Temperature
Pb鈭扚ree Package is Available*
ULTRAFAST RECTIFIER
8.0 AMPERES, 600 VOLTS
3
2
1
Mechanical Characteristics:
MARKING
DIAGRAM
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Case: Epoxy, Molded
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Weight: 1.9 Grams (Approximately)
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Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
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Lead Temperature for Soldering Purposes: 260擄C Max for 10 Seconds
MAXIMUM RATINGS
(Per Leg)
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated V
R
, T
C
= 120擄C) Total Device
Peak Repetitive Forward Current
(Rated V
R
, Square Wave,
20 kHz, T
C
= 120擄C)
Non鈭扲epetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Operating Junction and Storage Tempera-
ture Range
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FM
Value
600
Unit
V
1
2
3
ISOLATED TO鈭?20
CASE 221D
STYLE 3
AYWW
UH860G
AKA
4.0
8.0
16
A
A
I
FSM
100
A
A
Y
WW
UH860
G
AKA
= Assembly Location
= Year
= Work Week
= Device Code
= Pb鈭扚ree Package
= Diode Polarity
T
J
, T
stg
鈭?5
to +150
擄C
ORDERING INFORMATION
Device
MURHF860CT
Package
TO鈭?20
TO鈭?20
(Pb鈭扚ree)
Shipping
50 Units/Rail
50 Units/Rail
THERMAL CHARACTERISTICS
(Per Leg)
Rating
Max Thermal Resistance, Junction鈭抰o鈭扖ase
Symbol
R
qJC
Value
4.1
Unit
擄C/W
MURHF860CTG
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Preferred
devices are recommended choices for future use
and best overall value.
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2006
April, 2006
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Rev. 4
1
Publication Order Number:
MURHF860CT/D

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