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MTD2955V-1G Datasheet

  • MTD2955V-1G

  • Power MOSFET 12A, 60V P-Channel DPAK

  • 10頁

  • ONSEMI

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MTD2955V
Power MOSFET 12 A, 60 V
P鈭扖hannel DPAK
This Power MOSFET is designed to withstand high energy in the
avalanche and commutation modes. Designed for low voltage, high
speed switching applications in power supplies, converters and power
motor controls, these devices are particularly well suited for bridge
circuits where diode speed and commutating safe operating areas are
critical and offer additional safety margin against unexpected voltage
transients.
Features
http://onsemi.com
12 A, 60 V
R
DS(on)
= 185 mW (Typ)
鈥?/div>
Avalanche Energy Specified
鈥?/div>
I
DSS
and V
DS(on)
Specified at Elevated Temperature
鈥?/div>
Pb鈭扚ree Packages are Available
MAXIMUM RATINGS
(T
C
= 25擄C unless otherwise noted)
Rating
Drain鈭抰o鈭扴ource Voltage
Drain鈭抰o鈭扜ate Voltage (R
GS
= 1.0 MW)
Gate鈭抰o鈭扴ource Voltage
鈭?Continuous
鈭?Non鈭抮epetitive (t
p
鈮?/div>
10 ms)
Drain Current 鈭?Continuous
Drain Current
鈭?Continuous @ 100擄C
Drain Current
鈭?Single Pulse (t
p
鈮?/div>
10
ms)
Total Power Dissipation
Derate above 25擄C
Total Power Dissipation @ 25擄C (Note 2)
Operating and Storage Temperature
Range
Single Pulse Drain鈭抰o鈭扴ource Avalanche
Energy 鈭?Starting T
J
= 25擄C
(V
DD
= 25 Vdc, V
GS
= 10 Vdc, Peak
I
L
= 12 Apk, L = 3.0 mH, R
G
= 25
W)
Thermal Resistance
鈭?Junction to Case
鈭?Junction to Ambient (Note 1)
鈭?Junction to Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8鈥?from case for 10
seconds
Symbol
V
DSS
V
DGR
V
GS
V
GSM
I
D
I
D
I
DM
P
D
Value
60
60
鹵
20
鹵
25
12
8.0
42
60
0.4
2.1
鈭?5 to
175
216
Unit
Vdc
Vdc
G
P鈭扖hannel
D
S
Vdc
Vpk
Adc
Apk
Watts
W/擄C
Watts
擄C
mJ
4
DPAK鈭?
CASE 369D
STYLE 2
1
擄C
2
3
4
1 2
3
DPAK鈭?
CASE 369C
STYLE 2
T
J
, T
stg
E
AS
擄C/W
R
qJC
R
qJA
R
qJA
T
L
2.5
100
71.4
260
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended
pad size.
2. When surface mounted to an FR4 board using the 0.5 sq.in. pad size.
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 7 of this data sheet.
漏
Semiconductor Components Industries, LLC, 2004
1
April, 2004 鈭?Rev. 7
Publication Order Number:
MTD2955V/D

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