MSP
Vishay Dale
Thick Film Resistor Networks
Single-In-Line, Molded SIP; 01, 03, 05 Schematics
6, 8, 9 or 10 Pin "A" Profile and 6, 8 or 10 Pin "C" Profile
FEATURES
鈥?0.195" [4.95mm] "A" or 0.350" [8.89mm] "C" maximum seated
height
鈥?Highly stable thick film
鈥?Low temperature coefficient (- 55擄C to + 125擄C)
鹵
100ppm/擄C
鈥?Rugged, molded case construction
鈥?Reduces total assembly costs
鈥?Compatible with automatic insertion equipment and reduces PC
board space
鈥?Wide resistance range
鈥?Available in tube pack or side-by-side pack
STANDARD ELECTRICAL SPECIFICATIONS
MODEL/
SCHEMATIC
PROFILE
RESISTOR
POWER RATING
Max. @ 70
擄
C*
W
0.20
0.25
0.30
0.40
RESISTANCE
RANGE
STANDARD
TOLERANCE
鹵
%
2 Standard
(1, 5, 10, 20)**
2 Standard
(1, 5, 10, 20)**
鹵
2 Standard
(鹵 5%)**
TEMPERATURE
TCR
COEFFICIENT
TRACKING*
(- 55
擄
C to + 125
擄
C) (- 55
擄
C to + 125
擄
C)
ppm/
擄
C
ppm/
擄
C
鹵
100
鹵
100
鹵
100
鹵
50ppm/擄C
鹵
50ppm/擄C
鹵
150ppm/擄C
OPERATING
VOLTAGE
Max.
VDC
100
100
100
鈩?/div>
10 - 2.2M
10 - 2.2M
10 - 2.2M
MSP01
MSP03
MSP05
A
C
A
C
A
0.20
C
0.25
* Tighter tracking available
** Tolerances in brackets available on request
TECHNICAL SPECIFICATIONS
PARAMETER
Package Power Rating
(Maximum at + 25擄C and + 70擄C
Voltage Coefficient of Resistance
Dielectric Strength
Isolation Resistance (03 Schematic)
Operating Temperature Range
Storage Temperature Range
V
eff
VAC
鈩?/div>
擄C
擄C
< 50ppm typical
200
> 100M
- 55 to + 125
- 55 to + 150
UNIT
MSP SERIES
See Derating Curves
MECHANICAL SPECIFICATIONS
Marking Resistance to Solvents:
Solderability:
Body:
Terminals:
Weight:
Permanency testing per MIL-STD-202, Method 215.
Per MIL-STD-202, Method 208E, RMA flux.
Molded epoxy.
Copper alloy, tin-lead plated.
MSP06A = 0.4 gram
MSP08A = 0.5 gram
MSP09A = .55 gram
MSP10A = 0.6 gram
MSP06C = 0.7 gram
MSP08C = 0.9 gram
MSP10C = 1.1 gram
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For Technical Questions, contact: ff2aresistors@vishay.com
Document Number: 31510
Revision 25-Oct-00
VISHAY
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