鈥?/div>
Temperature Compensated over
BASIC CHIP
CARRIER ELEMENT
CASE 867鈥?8, STYLE 1
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 10 kPa (0 to 1.45 psi)
0.2 to 4.7 V OUTPUT
*
40擄 to +125擄C
VS
3
X鈥揹ucer
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
2
GND
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
1
Vout
DIFFERENTIAL
PORT OPTION
CASE 867C鈥?5, STYLE 1
PINS 4, 5 AND 6 ARE NO CONNECTS
PIN NUMBER
1
2
3
Vout
Gnd
VS
4
5
6
N/C
N/C
N/C
Figure 1. Fully Integrated Pressure Sensor Schematic
MAXIMUM RATINGS(1)
Parametrics
Overpressure(2) (P1 > P2)
Burst Pressure(2) (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
Pmax
Pburst
Tstg
TA
Value
75
100
鈥?40 to +125
鈥?40 to +125
Unit
kPa
kPa
擄C
擄C
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the Lead.
1. TC = 25擄C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Senseon and X鈥揹ucer are trademarks of Motorola, Inc.
REV 2
Motorola Sensor Device Data
漏
Motorola, Inc. 1997
1