The SOT鈭?23 Package can be soldered using wave or reflow.
eliminating the possibility of damage to the die.
鈥?/div>
Pb鈭扚ree Packages are Available
MAXIMUM RATINGS
(T
C
= 25擄C unless otherwise noted)
Rating
Drain鈭抰o鈭扴ource Voltage
Gate鈭抰o鈭扴ource Voltage 鈭?Continuous
Drain Current
Total Power Dissipation @ T
A
= 25擄C (Note 1)
Derate above 25擄C
Operating and Storage Temperature Range
Symbol
V
DS
V
GS
I
D
P
D
T
J
, T
stg
Value
240
鹵
20
700
1.5
12
鈭?5 to
150
Unit
Vdc
Vdc
mAdc
W
mW/擄C
擄C
A
WW
Unit
擄C/W
擄C
Sec
= Assembly Location
= Work Week
1
2
3
4
http://onsemi.com
700 mA, 240 V
R
DS(on)
= 6.0
W
N鈭扖hannel
D
G
S
MARKING
DIAGRAM
TO鈭?23
CASE 318E
STYLE 3
T2406
AWW
THERMAL CHARACTERISTICS
Rating
Thermal Resistance 鈭?Junction鈭抰o鈭扐mbient
(surface mounted) (Note 1)
Lead Temperature for Soldering Purposes,
1/16鈥?from case
Time in Solder Bath
Symbol
R
qJA
T
L
Value
83.3
260
10
PIN ASSIGNMENT
4
Drain
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. Device mounted on a glass epoxy printed circuit board 1.575 in x 1.575 in
x 0.059 in; mounting pad for the collector lead min. 0.93 sq in.
1
2
3
Gate
Drain
Source
ORDERING INFORMATION
Device
MMFT2406T1
MMFT2406T1G
MMFT2406T3
MMFT2406T3G
Package
SOT鈭?23
SOT鈭?23
(Pb鈭扚ree)
SOT鈭?23
SOT鈭?23
(Pb鈭扚ree)
Shipping
鈥?/div>
1000 Tape & Reel
1000 Tape & Reel
4000 Tape & Reel
2500 Tape & Reel
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2004
1
June, 2004 鈭?Rev. 3
Publication Order Number:
MMFT2406T1/D
1
2
3
4
