Metallurgically Bonded Construction Available as Dash One.
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Maximum Ratings
500 mW DC Power Dissipation (See Power Derating Curve In Figure 1)
-55擄C to +175擄C Operating and Storage Junction Temperature
LEADLESS GLASS
ZENER DIODE
SURFACE MOUNT
Package Dimensions In Inches
Application
This surface mountable zener diode series is similar to the 1N957B thru
1N992B in the DO-35 equivalent package except that it meets the new
JEDEC surface mount outline DO-213AA. It is an ideal selection for
applications of high density and low parasitic requirements. Due to its
glass hermetic qualities, it may also be considered for high reliability
applications.
Electrical Characteristics (see next page)
STEADY STATE POWER DERATING
1.4
1.2
DIM
A
B
U
MILLIMETERS
MIN
MAX
3.30
3.70
1.60
1.70
0.41
0.55
INCHES
MIN
.130
.063
.016
MAX
.146
.067
.022
P
D
= Power Dissipation
1.0
DO-213AA
Dash 1
Metallurgically Bonded
0.8
0.6
Mechanical
Characteristics
Case:
Hermetically sealed glass with solder
contact tabs at each end.
Finish:
All external surfaces are corrosion
resistant, readily solderable.
0.4
Non-Dash 1
0.2
0
0
20
40
60
80
100
120
140
160
180
200
T
EC
End Cap Case Temperature (潞C)
FIGURE 1
Polarity:
Banded end is cathode.
Thermal Resistance:
100擄C/Watt Maximum
junction to end caps for "-1" construction and
150擄C/W maximum junction to end caps for
commercial.
Mounting Position:
Any
Weight: 0.04 gm
MLL957B-92B.PDF 05-02-00
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