Inductors
For General Applications
SMD
FEATURES
鈥?High-reliability monolithic structure.
鈥?Ferrite core and magnetic shielding enables the design of com-
pact circuits with high packing density.
鈥?Excellent solderability and high heat resistance permits either
鏗俹w or re鏗俹w soldering.
APPLICATIONS
Personal computers, HDDs, or other various electronic appliances.
SPECIFICATIONS
Operating temperature range
Storage temperature range
鈥?5 to +85擄C
鈥?0 to +85擄C[Unit of products]
MLF Series MLF2012 Type
PRODUCT IDENTIFICATION
MLF 1608 A 1R0 K
T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L
脳
W
1608
2012
1.6
脳
0.8mm
2.0
脳
1.25mm
(3) Material code
(4) Inductance value
47N
R15
1R0
100
47nH[0.047
碌
H]
0.15
碌
H
1
碌
H
10
碌
H
RECOMMENDED REFLOW SOLDERING CONDITIONS
10s max.
220擄C
200擄C
150擄C
Natural
cooling
(5) Inductance tolerance
K
M
鹵10%
鹵20%
(6) Packaging style
Preheating 60 to 120s min.
40s max.
T
Taping [reel]
PACKAGING STYLE AND QUANTITIES
Time (s)
Packaging style
Taping
Product鈥檚 thickness
0.8/0.85mm
1.25mm
Quantity
4000 pieces/reel
2000 pieces/reel
HANDLING AND PRECAUTIONS
鈥?Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150擄C.
鈥?After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
鈥?The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
鈥?Do not expose the inductors to stray magnetic 鏗乪lds.
鈥?Avoid static electricity discharge during handling.
鈥?When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
300擄C. Soldering time should not exceed 3 seconds.
Speci鏗乧ations which provide more details for the proper and safe use of the described product are available upon request.
All speci鏗乧ations are subject to change without notice.
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