14 Pin DIL Uncooled Laser
Modules
Technical Data
LSC3X00
Features
鈥?Low Cost Plastic Package
(14 Pin DIL)
鈥?LSC3300: 100
碌
W (-10 dBm)
Min. Power Output
LSC3100: 1 mW (0 dBm)
Min. Power Output
鈥?1280 - 1330 nm Wavelength
鈥?Hermetic Laser Module
鈥?-40
擄
C to +85
擄
C Operation
Description
LSC3X00 laser modules are high
reliability fiber optic light sources
operating in the 1300 nanometer
band. They are particularly well
suited for applications where low
power dissipation is required.
The internal semiconductor lasers
are based upon InGaAsP buried
heterostructure (BH) technology
and fabricated by the Metal-
Organic Vapor Phase Epitaxy
(MOVPE) process, resulting in
long lifetimes and modest
threshold currents.
The LSC3X00 package includes a
photodiode for monitoring the
laser output. A longhorn type
heatsink mounting flange is
incorporated in the industry
standard 14 pin DIL package.
Two basic varieties are offered
for alternative power ranges. The
鈥渓ow power鈥?LSC3300 covers the
power range between 100
碌W
Applications
鈥?Telecommunications
鈥?Local Area and Metropolitan
Area Networks
鈥?Point to Point
Datacommunications
鈥?Fiber Optic Sensors
鈥?Cable Television
鈥?Military Communications
and Control Systems
鈥?Instrumentation
and 625
碌W.
The 鈥渉igh power鈥?/div>
LSC3100 uses the same laser
chip, but with tighter fiber
coupling to achieve output
powers from 1 mW to 2.5 mW.
The low cost outer package is
made feasible by our unique
design of hermetic miniature
laser submodule which houses
the electro-optic devices. The
submodule concept is used as a
building block in many other
Hewlett-Packard products
including cooled 1 mW 14 pin
lasers and DFB modules.
Laser Safety Warning
This device is a Class IIIb (3b) Laser Product. It may emit invisible laser radiation if operated with the fiber pigtail disconnected. To avoid
possible eye damage do not look into an unconnected fiber pigtail during laser operation. Do not exceed specified operating limits.
480
5963-1125E (7/94)
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