DRAM MODULE
KMM53632004BK/BKG
KMM53632004BK/BKG EDO Mode
32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V
GENERAL DESCRIPTION
The Samsung KMM53632004B is a 32Mx36bits Dynamic
RAM high density memory module. The Samsung
KMM53632004B consists of sixteen CMOS 16Mx4bits and
eight CMOS 16Mx1bit DRAMs in SOJ packages mounted on
a 72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling
capacitor is mounted on the printed circuit board for each
DRAM. The KMM53632004B is a Single In-line Memory Mod-
ule with edge connections and is intended for mounting into
72 pin edge connector sockets.
FEATURES
鈥?Part Identification
- KMM53632004BK(4K cycles/64ms Ref, SOJ, Solder)
- KMM53632004BKG(4K cycles/64ms Ref, SOJ, Gold)
鈥?Extended Out Data Mode Operation
鈥?CAS-before-RAS & Hidden Refresh capability
鈥?RAS-only refresh capability
鈥?TTL compatible inputs and outputs
鈥?Single +5V鹵10% power supply
鈥?JEDEC standard PDpin & pinout
鈥?PCB : Height(1420mil), double sided component
PERFORMANCE RANGE
Speed
-5
-6
t
RAC
50ns
60ns
t
CAC
13ns
15ns
t
RC
84ns
104ns
t
HPC
20ns
25ns
PIN CONFIGURATIONS
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Symbol
V
SS
DQ0
DQ18
DQ1
DQ19
DQ2
DQ20
DQ3
DQ21
Vcc
NC
A0
A1
A2
A3
A4
A5
A6
A10
DQ4
DQ22
DQ5
DQ23
DQ6
DQ24
DQ7
DQ25
A7
A11
Vcc
A8
A9
RAS3
RAS2
DQ26
DQ8
Pin
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
Symbol
DQ17
DQ35
Vss
CAS0
CAS2
CAS3
CAS1
RAS0
RAS1
NC
W
NC
DQ9
DQ27
DQ10
DQ28
DQ11
DQ29
DQ12
DQ30
DQ13
DQ31
Vcc
DQ32
DQ14
DQ33
DQ15
DQ34
DQ16
NC
PD1
PD2
PD3
PD4
NC
Vss
PIN NAMES
Pin Name
A0 - A11
DQ0 - 35
W
RAS0 - RAS3
CAS0 - CAS3
PD1 -PD4
Vcc
Vss
NC
Function
Address Inputs
Data In/Out
Read/Write Enable
Row Address Strobe
Column Address Strobe
Presence Detect
Power(+5V)
Ground
No Connection
PRESENCE DETECT PINS (Optional)
Pin
PD1
PD2
PD3
PD4
50NS
NC
Vss
Vss
Vss
60NS
NC
Vss
NC
NC
SAMSUNG ELECTRONICS CO., LTD.
reserves the right to
change products and specifications without notice.