KM416S8030
2M x 16Bit x 4 Banks Synchronous DRAM
FEATURES
鈥?JEDEC standard 3.3V power supply
鈥?LVTTL compatible with multiplexed address
鈥?Four banks operation
鈥?MRS cycle with address key programs
-. CAS Latency (2 & 3)
-. Burst Length (1, 2, 4, 8 & full page)
-. Burst Type (Sequential & Interleave)
鈥?All inputs are sampled at the positive going edge of the system
clock.
鈥?Burst Read Single-bit Write operation
鈥?DQM for masking
鈥?Auto & self refresh
鈥?64ms refresh period (4K cycle)
Preliminary
CMOS SDRAM
GENERAL DESCRIPTION
The KM416S8030 is 134,217,728 bits synchronous high data
rate Dynamic RAM organized as 4 x 2,097,152 words by 16
bits, fabricated with SAMSUNG鈥瞫 high performance CMOS
technology. Synchronous design allows precise cycle control
with the use of system clock I/O transactions are possible on
every clcok cycle. Range of operating frequencies, programma-
ble burst length and programmable latencies allow the same
device to be useful for a variety of high bandwidth, high perfor-
mance memory system applications.
ORDERING INFORMATION
Part NO.
KM416S8030T-G/F8
KM416S8030T-G/FH
KM416S8030T-G/FL
KM416S8030T-G/F10
MAX Freq.
125MHz
100MHz
100MHz
100MHz
LVTTL
54pin
TSOP(II)
Interface Package
FUNCTIONAL BLOCK DIAGRAM
I/O Control
LWE
Data Input Register
LDQM
Bank Select
2M x 16
Sense AMP
2M x 16
2M x 16
2M x 16
Refresh Counter
Output Buffer
Row Decoder
Row Buffer
DQi
Address Register
CLK
ADD
Column Decoder
Col. Buffer
Latency & Burst Length
LRAS
LCBR
LCKE
LRAS
LCBR
LWE
LCAS
Programming Register
LWCBR
LDQM
Timing Register
CLK
CKE
CS
RAS
CAS
WE
LDQM
UDQM
* Samsung Electronics reserves the right to
change products or specification without
notice.
REV. 2 Mar. '98